Senior Bonding Process Engineer – Wafer Bonding & Yield

Micron Technology; Singapore; On-site; SGD 70,000 - 90,000; Full time

Benefits offered by this job

Health insurance

Career development opportunities

Flexible working hours

Job summary

Micron Technology in Singapore is seeking a skilled Bonding Process & Equipment Engineer to develop and optimize wafer level bonding processes. You will play a crucial role in improving yield and reliability while collaborating with global teams to resolve complex manufacturing challenges.

Ideal candidates should possess a strong background in semiconductor manufacturing, process optimization, and have over 7 years of relevant experience. Micron offers a supportive environment focused on innovation and excellence.

Qualifications

• 7 years+ relevant proven experience in semiconductor manufacturing or advanced packaging.
• Strong knowledge of semiconductor bonding processes.
• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms.

Responsibilities

• Develop, qualify, and optimize bonding process technologies.
• Lead yield enhancement initiatives through root cause analysis.
• Collaborate with suppliers for technology development.

Skills

Semiconductor bonding processes

Data analysis

Problem-solving

Statistical modeling

Education

Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field

Job description

Micron Technology in Singapore is seeking a skilled Bonding Process & Equipment Engineer to develop and optimize wafer level bonding processes. You will play a crucial role in improving yield and reliability while collaborating with global teams to resolve complex manufacturing challenges.

Ideal candidates should possess a strong background in semiconductor manufacturing, process optimization, and have over 7 years of relevant experience. Micron offers a supportive environment focused on innovation and excellence.