Bonding Process Engineer — Yield & Process Optimization

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 80,000 - 110,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a Bonding Process & Equipment Engineer to optimize and develop wafer-level bonding processes. The role involves improving yield and reducing costs while addressing complex manufacturing challenges.

Ideal candidates should have strong expertise in semiconductor bonding with at least 7 years of relevant experience in manufacturing. Collaboration and problem-solving skills are essential, along with proficiency in data analysis and statistical methodologies.

Qualifications

• 7+ years of relevant proven experience in semiconductor manufacturing or advanced packaging.
• Strong knowledge of semiconductor bonding processes (wafer-to-wafer hybrid bonding, fusion bonding preferred).
• Excellent communication and collaboration skills across global teams.

Responsibilities

• Develop, qualify, and optimize bonding process technologies.
• Lead yield enhancement initiatives by analyzing process, tool, and material interactions.
• Support technology transfer and ramp-up across global sites.

Skills

Data analysis

SPC

Problem-solving

Collaboration

Statistical modeling

Education

Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field

Tools

DOE methodologies

FMEA

CMP

Wafer-to-wafer bonding tools

Job description

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a Bonding Process & Equipment Engineer to optimize and develop wafer-level bonding processes. The role involves improving yield and reducing costs while addressing complex manufacturing challenges.

Ideal candidates should have strong expertise in semiconductor bonding with at least 7 years of relevant experience in manufacturing. Collaboration and problem-solving skills are essential, along with proficiency in data analysis and statistical methodologies.