Bonding Process Engineer: Yield & Tech Transfer

Micron Technology, Inc; Singapore; On-site; SGD 80,000 - 110,000; Full time

Job summary

Micron Technology, Inc in Singapore is seeking a Bonding Process & Equipment Engineer to develop and optimize bonding process technologies. This role involves improving yield and collaborating with global teams to resolve complex manufacturing challenges.

The ideal candidate will have 7+ years of semiconductor manufacturing experience, strong knowledge of bonding processes, and engineering skills in a high-volume production environment.

Qualifications

• Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred).
• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms.
• Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is preferred.

Responsibilities

• Develop, qualify, and optimize bonding process technologies.
• Lead yield enhancement initiatives by analyzing process.
• Collaborate with equipment engineering to optimize bonding tools.

Skills

Data analysis

SPC

Statistical modeling

Problem-solving

Communication

Collaboration

Education

Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field

Tools

DOE

FMEA

SPC

Job description

Micron Technology, Inc in Singapore is seeking a Bonding Process & Equipment Engineer to develop and optimize bonding process technologies. This role involves improving yield and collaborating with global teams to resolve complex manufacturing challenges.

The ideal candidate will have 7+ years of semiconductor manufacturing experience, strong knowledge of bonding processes, and engineering skills in a high-volume production environment.