Engineer (Bond Equipment)

Vanguard International Semiconductor Corporation (VIS); Singapore; On-site; SGD 60,000 - 120,000; Full time

Job summary

Vanguard International Semiconductor Corporation (VIS) is seeking an Equipment Owner for wafer bonding equipment in the Photo Department. You will ensure optimal tool performance, reliability, and process capability, and collaborate with vendors to meet equipment KPIs.

You will evaluate equipment upgrades, oversee installation and maintenance, and lead projects for capacity, yield, and cost improvements while providing training and technical support to production teams.

Qualifications

• Bachelor's degree in an engineering discipline listed.
• Minimum 2 years of semiconductor equipment or process engineering experience.
• Hands-on experience with wafer bonders and related equipment.
• Strong knowledge of troubleshooting, optimization, qualification, and production support.
• Experience implementing preventive and predictive maintenance strategies.
• Ability to execute upgrades and continuous improvement projects.
• Strong analytical, communication, and stakeholder management skills.
• Willing to work shifts (normal, swing, or 12-hour rotating).

Responsibilities

• Serve as Equipment Owner for wafer bonding equipment in the Photo Department.
• Evaluate and justify equipment upgrades aligned with photonics manufacturing needs.
• Oversee installation, qualification, modification, upgrades, and maintenance of wafer bonders.
• Collaborate with vendors to resolve issues and meet KPIs (MTTR, MTBF, OEE).
• Lead capacity-expansion, yield improvement, and cost-optimization projects.
• Review SPC, equipment, and FDC data to identify trends and corrective actions.
• Provide technical support to manufacturing, maintenance and process engineering teams.
• Develop and improve preventive and predictive maintenance procedures and docs.
• Conduct technical training for operators, technicians, and engineers.
• Mentor shift engineers in troubleshooting and root cause analysis.

Skills

Equipment troubleshooting

Process optimization

Preventive maintenance

Predictive maintenance

Data analysis

Root cause analysis

Education

Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Microelectronics Engineering, or related Engineering

Tools

Wafer Bonders

Gemini Bonders

SAM Coat equipment

Job description

Job Description

• Serve as the Equipment Owner for wafer bonding equipment within the Photo Department, ensuring optimal tool performance, reliability, and process capability.
• Evaluate, select, and justify equipment, upgrades, and solutions that are cost-effective and aligned with photonics manufacturing requirements.
• Oversee installation, qualification, modification, upgrades, and maintenance of wafer bonders, Gemini bonders, and related production equipment.
• Partner with equipment vendors to resolve technical issues and manage vendor performance to meet or exceed equipment KPIs, including MTTR, MTBF, OEE, and uptime targets.
• Establish and execute projects focused on capacity expansion, yield improvement, defect reduction, cost savings, and equipment optimization.
• Review and analyze SPC data, equipment performance metrics, and Fault Detection & Classification (FDC) data to identify trends and implement effective corrective actions.
• Provide technical support to manufacturing, maintenance, and process engineering teams to ensure stable production operations.
• Develop, maintain, and continuously improve preventive and predictive maintenance procedures, schedules, and documentation.
• Conduct technical training for operators, technicians, and engineers on equipment operation, maintenance, troubleshooting, and best practices.
• Mentor and coach shift engineers in systematic hardware troubleshooting, root cause analysis, and the development of troubleshooting guides, OCAPs, and lesson-learned documentation.

Job Requirements

• Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Microelectronics Engineering, or related Engineering discipline.
• Minimum 2 years of semiconductor equipment or process engineering experience, preferably in Lithography/Photo, Advanced Packaging, or Wafer Bonding operations.
• Hands-on experience with Wafer Bonders, Gemini Bonders, SAM Coat equipment.
• Strong knowledge of equipment troubleshooting, process optimization, equipment qualification, and production support in a high-volume manufacturing environment.
• Experience in developing, implementing, and sustaining preventive and predictive maintenance strategies to maximize equipment uptime and performance.
• Ability to execute equipment upgrades, hardware modifications, and continuous improvement projects to enhance reliability, capability, and operational efficiency.
• Strong analytical and logical thinking skills with a proven track record of driving effective problem resolution.
• Excellent communication, interpersonal, and stakeholder management skills.
• Willing to work Normal Shift, Swing Shift, or 12-hour rotating shift when required.