Advanced Packaging Engineer - Die-Level Tech

Micron Technology, Inc.; Singapore; On-site; SGD 80,000 - 115,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an Engineer for Advanced Packaging Die Level Technology Engineering (APTD CEM).

You will develop and optimize wafer-level packaging, die stacking, and related processes, collaborating with Package Integration and Front End teams to ensure high yield and robust product transfer. Candidates should hold a bachelor’s or higher in engineering or science, excel in data analytics with Python, R, SQL, and have experience with automation via Visual Basic.

Qualifications

• Bachelor’s degree in Engineering or Science.
• Strong analytical and problem-solving skills.
• Experience or internship in semiconductor is a plus.

Responsibilities

• Develop and optimize wafer-level packaging and die stacking processes.
• Collaborate with Package Integration, Assembly Engineering and other teams to ensure high yield.
• Establish process parameters for semiconductor equipment and validate performance.
• Analyze data to drive continuous improvement and control strategies.
• Support transfer from development to high-volume manufacturing with proper POR/MOR documentation.

Skills

Python

R

SQL

Visual Basic

Education

Bachelor’s or advanced degree in Engineering or Science

Tools

Visual Basic for automation

Job description

Micron Technology, Inc. in Singapore is seeking an Engineer for Advanced Packaging Die Level Technology Engineering (APTD CEM).

You will develop and optimize wafer-level packaging, die stacking, and related processes, collaborating with Package Integration and Front End teams to ensure high yield and robust product transfer. Candidates should hold a bachelor’s or higher in engineering or science, excel in data analytics with Python, R, SQL, and have experience with automation via Visual Basic.