Advanced Packaging Integration Engineer

GLOBALFOUNDRIES SINGAPORE PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

GlobalFoundries Singapore is seeking a Development Integration Engineer to join the Advanced Packaging team. You will lead process development and integration toward enabling new features on FINFET and FDSOI technologies, from early demonstration to manufacturing transfer.

Focus areas include bonding, TSV, and DT Capacitors for advanced packaging support. You will drive project collaboration across sites, craft robust process flows, and assure defect-free manufacturing across the ULP CMOS suite.

Qualifications

• Education – BS Engineering or Electrical/Electronics related field.
• BS or equivalent in Electrical/Electronics Eng, Materials or related field.
• Experience in advanced module development, integration or packaging.
• BS + min 5 yrs relevant experience; MS + 4 yrs; PhD + 2 yrs.
• Skills: lot handling, DOE, inline/HOL/ET analysis and monitoring; strong communication.
• Fluency in English – written & spoken.

Responsibilities

• Lead complex development integration initiatives to meet customer/tech requirements.
• Create process flows and recipes to meet performance, reliability and defect targets.
• Ensure methods to test devices and structures being developed.
• Develop and implement process control and inspection procedures.
• Identify issues, run experiments to diagnose root cause and improve processes.
• Analyze data, reports to identify trends and corrective actions.
• Lead development through to manufacturing transfer; finalize processes.
• Prepare presentations for management or external customers as needed.
• Collaborate with other projects as required.

Skills

Process integration

DOE analysis

Cross-functional collab

English fluency

Education

BS in Engineering

Electrical/Electronics Eng

Job description

GlobalFoundries Singapore is seeking a Development Integration Engineer to join the Advanced Packaging team. You will lead process development and integration toward enabling new features on FINFET and FDSOI technologies, from early demonstration to manufacturing transfer.

Focus areas include bonding, TSV, and DT Capacitors for advanced packaging support. You will drive project collaboration across sites, craft robust process flows, and assure defect-free manufacturing across the ULP CMOS suite.