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GlobalFoundries Singapore seeks an Experienced Equipment Engineer to join our 300mm Advance Packaging Center and lead the setup, optimization, and troubleshooting of bond, debond, and related processes on wafer/frame level operations.
You will drive tool qualification, work with vendors, run DOE studies, and implement preventive maintenance to boost yield, uptime and reliability across advanced packaging lines.
GlobalFoundries Singapore seeks an Experienced Equipment Engineer to join our 300mm Advance Packaging Center and lead the setup, optimization, and troubleshooting of bond, debond, and related processes on wafer/frame level operations.
You will drive tool qualification, work with vendors, run DOE studies, and implement preventive maintenance to boost yield, uptime and reliability across advanced packaging lines.