Principal Process Engineer - Advanced Packaging & Etch

GlobalFoundries; Singapore; On-site; SGD 89,000 - 123,000; Full time

Job summary

GlobalFoundries Singapore is seeking an Experienced Equipment Engineer to join our 300mm Advance Packaging Center. You will develop and optimize diffusion-related packaging processes (bond & Debond, pre-bond plasma/UV/clean), handle die re-constitution, annealing, and TSV processes, and work across manufacturing with tool owners.

You will lead experiments, startup and qualification activities, and drive process robustness using DOE and SPC.

Qualifications

• BS/MS/PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or related engineering field.
• Excellent verbal and written communication.
• Strong interpersonal skills and ability to work with diverse cultures.
• Relevant working experience with chip packaging equipment and process tools.

Responsibilities

• Design, execute, and analyze experiments to develop advanced packaging etch processes meeting tech and manufacturing targets.
• Startup and qualify new processes and equipment within timeline; coordinate with Equipment Engineer on acceptance.
• Improve process robustness for high-volume manufacturing using statistics, DOE, data-driven decisions, and problem-solving.
• Collaborate with equipment team to improve equipment productivity indices.
• Resolve complex process or yield-related issues within modules.
• Support Integration and Quality teams to meet qualification and reliability requirements.
• Sustain and improve process SPC to meet quality, cost, and productivity metrics.
• Coach and develop other engineers on advanced packaging etch processes.

Skills

Communication skills

Cross-cultural collaboration

Education

Engineering degree (B/S/PhD)

Tools

Bonder TEL W2W / BESI D2W

Alpha 303 / Mattson- Helios

Job description

GlobalFoundries Singapore is seeking an Experienced Equipment Engineer to join our 300mm Advance Packaging Center. You will develop and optimize diffusion-related packaging processes (bond & Debond, pre-bond plasma/UV/clean), handle die re-constitution, annealing, and TSV processes, and work across manufacturing with tool owners.

You will lead experiments, startup and qualification activities, and drive process robustness using DOE and SPC.