Principal Process Engineer - Advanced Packaging & Etch

GlobalFoundries

Singapore

On-site

SGD 89,000 - 123,000

Full time

9 days ago

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Job summary

GlobalFoundries Singapore is seeking an Experienced Equipment Engineer to join our 300mm Advance Packaging Center. You will develop and optimize diffusion-related packaging processes (bond & Debond, pre-bond plasma/UV/clean), handle die re-constitution, annealing, and TSV processes, and work across manufacturing with tool owners.

You will lead experiments, startup and qualification activities, and drive process robustness using DOE and SPC.

Qualifications

BS/MS/PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or related engineering field.
Excellent verbal and written communication.
Strong interpersonal skills and ability to work with diverse cultures.
Relevant working experience with chip packaging equipment and process tools.

Responsibilities

Design, execute, and analyze experiments to develop advanced packaging etch processes meeting tech and manufacturing targets.
Startup and qualify new processes and equipment within timeline; coordinate with Equipment Engineer on acceptance.
Improve process robustness for high-volume manufacturing using statistics, DOE, data-driven decisions, and problem-solving.
Collaborate with equipment team to improve equipment productivity indices.
Resolve complex process or yield-related issues within modules.
Support Integration and Quality teams to meet qualification and reliability requirements.
Sustain and improve process SPC to meet quality, cost, and productivity metrics.
Coach and develop other engineers on advanced packaging etch processes.