Senior Equipment Engineer, Advanced Packaging

GLOBALFOUNDRIES SINGAPORE PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

GLOBALFOUNDRIES Singapore PTE. LTD. is seeking an Experienced Equipment Engineer to join the 300mm Advanced Packaging Center in Singapore.

You will develop and optimize unit processes for bond & debond, die re-constitution, annealing, and TSV integration, across wafer and frame-form carrier levels. You will lead startup and qualification of new tools, work with vendors, and drive DOE/DOE-based improvements to meet performance, yield, and reliability targets while controlling cost of ownership.

Qualifications

• BS degree or Master’s/PhD in Electrical/ Chemical Engineering or related field.
• Experience with Metrology Equipment in Advanced packaging Bonder and die re-constitution/annealing tools.
• Excellent verbal and written communication skills.

Responsibilities

• Manage new equipment startup, qualification and tool matching to support production.
• Design, execute and analyze experiments to develop advanced packaging processes.
• Liaise with vendors to resolve equipment issues and improve performance.
• Improve equipment robustness for high volume manufacturing using statistical tools and DOE.
• Establish preventive maintenance plans and optimize PM for quality, cost, and productivity.
• Sustain and improve SPC, DOE, FDC and other statistical analyses.
• Implement equipment improvement projects to enhance efficiency and reliability.
• Provide long-term solutions to address daily issues and hardware defects.
• Collaborate with Process team to improve equipment productivity indices.
• Manage spare parts stocks and coordinate with vendors to optimize inventory.
• Forecast budgets for equipment expenditures and track spending.
• Coach engineers on diffusion equipment maintenance and troubleshooting.
• Ensure compliance with TS16949 quality requirements and safety programs.

Skills

Equipment startup

Metrology equipment experience

DOE / SPC

Lean Six Sigma knowledge

Vendor liaison

Cross-cultural communication

Education

BS/MS/PhD in Electrical/Chemical Engineering or related field

Job description

GLOBALFOUNDRIES Singapore PTE. LTD. is seeking an Experienced Equipment Engineer to join the 300mm Advanced Packaging Center in Singapore.

You will develop and optimize unit processes for bond & debond, die re-constitution, annealing, and TSV integration, across wafer and frame-form carrier levels. You will lead startup and qualification of new tools, work with vendors, and drive DOE/DOE-based improvements to meet performance, yield, and reliability targets while controlling cost of ownership.