Principal Engineer (Advanced Packaging)

GLOBALFOUNDRIES SINGAPORE PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

GLOBALFOUNDRIES Singapore PTE. LTD. is seeking an Experienced Equipment Engineer to join the 300mm Advanced Packaging Center in Singapore.

You will develop and optimize unit processes for bond & debond, die re-constitution, annealing, and TSV integration, across wafer and frame-form carrier levels. You will lead startup and qualification of new tools, work with vendors, and drive DOE/DOE-based improvements to meet performance, yield, and reliability targets while controlling cost of ownership.

Qualifications

• BS degree or Master’s/PhD in Electrical/ Chemical Engineering or related field.
• Experience with Metrology Equipment in Advanced packaging Bonder and die re-constitution/annealing tools.
• Excellent verbal and written communication skills.

Responsibilities

• Manage new equipment startup, qualification and tool matching to support production.
• Design, execute and analyze experiments to develop advanced packaging processes.
• Liaise with vendors to resolve equipment issues and improve performance.
• Improve equipment robustness for high volume manufacturing using statistical tools and DOE.
• Establish preventive maintenance plans and optimize PM for quality, cost, and productivity.
• Sustain and improve SPC, DOE, FDC and other statistical analyses.
• Implement equipment improvement projects to enhance efficiency and reliability.
• Provide long-term solutions to address daily issues and hardware defects.
• Collaborate with Process team to improve equipment productivity indices.
• Manage spare parts stocks and coordinate with vendors to optimize inventory.
• Forecast budgets for equipment expenditures and track spending.
• Coach engineers on diffusion equipment maintenance and troubleshooting.
• Ensure compliance with TS16949 quality requirements and safety programs.

Skills

Equipment startup

Metrology equipment experience

DOE / SPC

Lean Six Sigma knowledge

Vendor liaison

Cross-cultural communication

Education

BS/MS/PhD in Electrical/Chemical Engineering or related field

Job description

Introduction:

GlobalFoundries Singapore is seeking highly skilled and motivated Experienced Equipment Engineer to become part of our starting 300mm Advance Packaging Center, Singapore. The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV ) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level), do troubleshooting for process and tool issues. Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.

Job Responsibilities:

• Manage new equipment start-up, qualification and tool matching to support production, from facilities hookup, vendor startup, to acceptance of equipment for production
• Designing, executing, and analyzing experiments to develop advanced packaging process (bond/debond, die re-constitution, annealing/RTA) to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. Tool stability, cost of ownership) targets.
• Liaise & work with vendors to resolve equipment issues and improve equipment performance
• Improve Equipment robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.
• Establish Preventive Maintenance (PM) plans for all equipment and optimize PM for quality, cost, and productivity
• Sustain and improve on SPC, DOE, FDC, ECMS and all the statistical analysis tools to optimizing equipment robustness
• Implement equipment improvement projects to improve equipment efficiency, cost reduction and reliability of equipment
• Provide long term solution to address daily issues. Resolve department hardware chronicle issues
• To work closely with Process team to improve equipment productivity indices
• Establish stock levels of essential spare parts and consumables to support equipment maintenance based on forecasted manufacturing volume. Liaise with vendors to minimize / eliminate over-stock or under-stock
• Forecast financial budgets for equipment expenditures. Setup tracking system to monitor expenditure
• To coach and develop engineers on diffusion equipment maintenance knowledge & performing hardware trouble shooting
• Self audit and update specifications to meet TS16949 Quality Standard requirements
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Required Qualifications:

• BS degree or Master's Degree or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or other relevant engineering physical science discipline is required
• Relevant working experiences in various Metrology Equipment in Advanced packaging Bonder (TEL W2W/ BESI D2W), die re-constitution & Annealing (TEL Alpha 303, mattson- helios) process tool.
• Excellent verbal and written communication skills.
• Strong interpersonal skills and ability to work effectively with different cultures.