MTS - Integration Engineer (Advanced packaging Integrator)

GLOBALFOUNDRIES SINGAPORE PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

GlobalFoundries Singapore is seeking a Development Integration Engineer to join the Advanced Packaging team. You will lead process development and integration toward enabling new features on FINFET and FDSOI technologies, from early demonstration to manufacturing transfer.

Focus areas include bonding, TSV, and DT Capacitors for advanced packaging support. You will drive project collaboration across sites, craft robust process flows, and assure defect-free manufacturing across the ULP CMOS suite.

Qualifications

• Education – BS Engineering or Electrical/Electronics related field.
• BS or equivalent in Electrical/Electronics Eng, Materials or related field.
• Experience in advanced module development, integration or packaging.
• BS + min 5 yrs relevant experience; MS + 4 yrs; PhD + 2 yrs.
• Skills: lot handling, DOE, inline/HOL/ET analysis and monitoring; strong communication.
• Fluency in English – written & spoken.

Responsibilities

• Lead complex development integration initiatives to meet customer/tech requirements.
• Create process flows and recipes to meet performance, reliability and defect targets.
• Ensure methods to test devices and structures being developed.
• Develop and implement process control and inspection procedures.
• Identify issues, run experiments to diagnose root cause and improve processes.
• Analyze data, reports to identify trends and corrective actions.
• Lead development through to manufacturing transfer; finalize processes.
• Prepare presentations for management or external customers as needed.
• Collaborate with other projects as required.

Skills

Process integration

DOE analysis

Cross-functional collab

English fluency

Education

BS in Engineering

Electrical/Electronics Eng

Job description

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

The ULP CMOS product team is looking to hire a development integration engineer to join our growing Advanced packaging team in our Singapore facility. Applicants for this position would be responsible for leading process development and integration toward enabling advanced packaging new features and new offerings on base technologies in FINFET and FDSOI from early process demonstration through manufacturing transfer. Areas of focus could bonding, TSV, DT Capacitor for advanced packaging support of the full ULP CMOS suite of products.

Essential Responsibilities:

• Responsible for leading complex development integration initiatives to meet customer and technology requirements to further GF advanced packaging strategy.

• Leading creation of process flows and process recipes to enable meeting the product requirements for performance, reliability and defect free manufacturing.

• Ensure methods and processes in place to test the devices and structures being developed

• Develops and implements methods and procedures for process control and inspection to ensure that the products are free of flaws and function as designed

• Identify issues and technical challenges, formulate appropriate experiments to understand root cause and improve processes to meet requirements.

• Analyze various data, physical, electrical or defect reports to determine trends and recommend corrective actions

• Lead and execute develop continual improvement through the product development process through to eventual manufacturing transfer; including freeze developed processes in preparation for manufacturing and meet all product requirements.

• May require creation of presentations to provide occasional management or external customer updates.

• Work and collaborate other projects and/or assignments as needed

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

• Travel <10% to other GlobalFoundries facilities may be necessary

Required Qualifications:

• Education –BS Engineering Degree. Electrical/Electronics Engineering or related field.

• Bachelor of Science (B.S.) or equivalent degree in Electrical/Electronics Engineering, Material Science or a related field from an accredited university.

• Additional professional experience in advanced module development, integration and/or advanced packaging:

• B.S. + minimum of 5 years of relevant experience

• M.S. + minimum of 4 of relevant experience

• Ph.D. + minimum of 2 of relevant experience

• Skills: Familiarity with integration skills including lot handling, DOE, inline/HOL/ET analysis and monitoring. Strong communication and coordination skills cross the department and cross-organizationally. Strong team collaborator across multiple geographical locations & proactive mindset.

• Fluency in English Language – written & verbal

Preferred Qualifications:

• Project management skills - i.e., the ability to innovate and execute solutions that matter; the ability to navigate ambiguity and communicate and track projects through to completion.

• Strong written and verbal communication skills.

• Strong planning & organizational skills