Principal Engineer (Advanced Packaging)

GlobalFoundries; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

GlobalFoundries Singapore seeks an Experienced Equipment Engineer to join our 300mm Advance Packaging Center and lead the setup, optimization, and troubleshooting of bond, debond, and related processes on wafer/frame level operations.

You will drive tool qualification, work with vendors, run DOE studies, and implement preventive maintenance to boost yield, uptime and reliability across advanced packaging lines.

Qualifications

• BS/Master's/PhD in Electrical, Chemical Engineering or related physical sciences.
• Experience with metrology tools in advanced packaging (Bond/Debond, Die re-constitution, Annealing).
• Excellent verbal and written communication skills.
• Strong interpersonal skills and ability to work with diverse cultures.

Responsibilities

• Manage new equipment start-up, qualification and tool matching to support production.
• Design experiments to develop advanced packaging processes (bond/debond, die re-constitution, annealing/RTA).
• Liaise with vendors to resolve equipment issues and improve performance.
• Use DOE, SPC, Six Sigma and lean methods to improve equipment robustness.
• Establish preventive maintenance plans and optimize for quality, cost and productivity.
• Forecast budgets for equipment expenditures and track spending.
• Coach and develop engineers on equipment maintenance knowledge and troubleshooting.
• Self-audit and update specifications to meet TS16949 Quality Standard requirements.

Skills

Communication skills

Interpersonal skills

Team collaboration

Education

Electrical Engineering

Chemical Engineering

Solid State Physics

Tools

TEL W2W

BESI D2W

TEL Alpha 303

Mattson- Helios

Job description

Introduction:

GlobalFoundries Singapore is seeking highly skilled and motivated Experienced Equipment Engineer to become part of our starting 300mm Advance Packaging Center, Singapore. The primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV ) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level), do troubleshooting for process and tool issues. Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.

Job Responsibilities:

• Manage new equipment start-up, qualification and tool matching to support production, from facilities hookup, vendor startup, to acceptance of equipment for production
• Designing, executing, and analyzing experiments to develop advanced packaging process (bond/debond, die re-constitution, annealing/RTA) to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. Tool stability, cost of ownership) targets.
• Liaise & work with vendors to resolve equipment issues and improve equipment performance
• Improve Equipment robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.
• Establish Preventive Maintenance (PM) plans for all equipment and optimize PM for quality, cost, and productivity
• Sustain and improve on SPC, DOE, FDC, ECMS and all the statistical analysis tools to optimizing equipment robustness
• Implement equipment improvement projects to improve equipment efficiency, cost reduction and reliability of equipment
• Provide long term solution to address daily issues. Resolve department hardware chronicle issues
• To work closely with Process team to improve equipment productivity indices
• Establish stock levels of essential spare parts and consumables to support equipment maintenance based on forecasted manufacturing volume. Liaise with vendors to minimize / eliminate over-stock or under-stock
• Forecast financial budgets for equipment expenditures. Setup tracking system to monitor expenditure
• To coach and develop engineers on diffusion equipment maintenance knowledge & performing hardware trouble shooting
• Self audit and update specifications to meet TS16949 Quality Standard requirements
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Required Qualifications:

• BS degree or Master's Degree or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or other relevant engineering physical science discipline is required
• Relevant working experiences in various Metrology Equipment in Advanced packaging Bonder (TEL W2W/ BESI D2W), die re-constitution & Annealing (TEL Alpha 303, mattson- helios) process tool.
• Excellent verbal and written communication skills.
• Strong interpersonal skills and ability to work effectively with different cultures.