Advanced packaging Engineer (Principal/MTS)

GLOBALFOUNDRIES SINGAPORE PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking an experienced MTS/Principal Integration Engineer to lead the Advanced Packaging Program. You will oversee the integration of 2.5D and 3D heterogeneous integration technologies while managing complex projects and mentoring junior engineers. The ideal candidate will hold a degree in engineering and possess strong technical skills. This role offers a unique opportunity to work on advanced packaging solutions that drive the next generation of semiconductor devices.

Qualifications

• 7 years of experience in semiconductor packaging, specifically in 2.5D and 3D heterogeneous integration technologies.
• In-depth knowledge of interposer design, TSVs, die stacking, and system-in-package (SiP).
• Proven track record of managing complex projects with cross-functional teams.

Responsibilities

• Oversee the integration of 2.5D and 3D heterogeneous integration technologies.
• Provide guidance in packaging processes, materials, and equipment.
• Develop and maintain project plans, timelines, and budgets.

Skills

2.5D heterogeneous integration technologies

3D heterogeneous integration technologies

Project management

Problem-solving

Communication

Team player

Education

Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field

Job description

We are seeking an experienced and highly motivated MTS/Principal Integration Engineer to lead our Advanced Packaging Program, with a specific focus on 2.5D and 3D heterogeneous integration technologies. The ideal candidate will have extensive knowledge and hands‑on experience in these advanced semiconductor packaging technologies, along with a strong background in engineering integration processes. This position offers a unique opportunity to work on cutting‑edge packaging solutions that will drive the next generation of semiconductor devices.

Responsibilities

• Lead Integration Activities: Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies, ensuring seamless collaboration between design, process, and manufacturing teams.
• Technical Expertise: Provide guidance and expertise in 2.5D and 3D packaging processes, materials, and equipment. Stay current with industry trends and advancements.
• Project Management: Develop and maintain project plans, timelines, and budgets. Coordinate with cross‑functional teams to ensure project milestones are met.
• Process Development: Drive the development and optimization of 2.5D and 3D heterogeneous integration processes, including interposer design, through‑silicon vias (TSVs), die stacking, and thermal management.
• Quality Assurance: Implement and monitor quality control measures to ensure the highest standards of product reliability and performance.
• Collaboration: Work closely with R&D, design, and manufacturing teams to integrate new 2.5D and 3D packaging solutions into production. Foster a collaborative and innovative environment.
• Documentation: Prepare and maintain detailed technical documentation, including process flow diagrams, work instructions, and validation reports.
• Problem Solving: Identify and resolve technical challenges related to 2.5D and 3D packaging integration. Implement corrective actions and continuous improvement initiatives.
• Training and Mentorship: Mentor junior engineers and technicians, providing guidance and support in their professional development.
• Compliance: Ensure all packaging processes comply with industry standards and regulatory requirements.

Qualifications

• Education: Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• 7 years of experience in semiconductor packaging, specifically in 2.5D and 3D heterogeneous integration technologies.
• Technical Skills: In‑depth knowledge of 2.5D and 3D heterogeneous integration technologies, including interposer design, TSVs, die stacking, and system‑in‑package (SiP).
• Project Management: Proven track record of managing complex projects with cross‑functional teams.
• Problem Solving: Strong analytical and problem‑solving skills. Ability to troubleshoot and resolve technical issues efficiently.
• Communication: Excellent verbal and written communication skills. Ability to convey technical information clearly and concisely.
• Team Player: Demonstrated ability to work collaboratively in a team environment. Strong leadership and mentorship skills.