Staff Advance Packaging Designer

Advanced Micro Devices (S) Pte Ltd; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Advanced Micro Devices (S) Pte Ltd is seeking a highly experienced Package Design Engineer to drive end-to-end package design for complex products in a fast-paced, high-pressure environment. The role requires ownership across multiple programs and delivering high-quality designs with speed and precision.

You will develop substrate layouts, bump maps, and interposer designs for 2.5D/3D architectures, collaborate with SI/PI, mechanical, and SOC teams, and advance design methodologies using

Qualifications

• Experience designing complex substrate/Silicon Bridge/Interposers.
• Proven ability to execute in multi-project, fast-paced environments.
• Strong background in advanced packaging technologies.
• Hands-on experience with EDA tools.

Responsibilities

• Lead end-to-end package design execution for complex products, meeting performance, cost, quality, and schedule targets.
• Handle multiple concurrent design programs in a fast-paced environment.
• Develop substrate layouts, bump maps, and interposer designs for 2.5D/3D packaging.
• Drive design decisions through collaboration with SI/PI, mechanical, and SOC teams.
• Interface with OSATs, foundries, and substrate vendors to optimize solutions.
• Mentor junior engineers and promote engineering excellence.

Skills

Ownership & accountability

AI/ML and automation

Cross-functional collaboration

Communication skills

Fast-paced execution

Education

Bachelor's or higher in Electrical/Computer Engineering

Job description

Help turn “possibility” into “reality” every day. At AMD, we push the boundaries of what is possible by delivering innovative, high-performance computing solutions across data center, AI, and advanced packaging technologies.

We are seeking a highly experienced Package Design Engineer to support complex package design execution. This role requires a self-driven technical expert who thrives in a fast-paced, dynamic, and high-pressure environment, and can deliver high-quality designs with speed, precision, and scalability.

The successful candidate will play a key role in advancing AMD’s packaging methodologies by leveraging AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration and advanced packaging architectures.

THE PERSON:

The ideal candidate is an experienced package or silicon physical designer who:

• Demonstrates strong ownership and accountability across multiple programs
• Excels in fast-phase execution environments with competing priorities
• Applies AI/ML and automation to improve design productivity and quality
• Operates with minimal supervision while influencing cross-functional teams
• Balances deep technical expertise with strong collaboration and communication skills

KEY RESPONSIBILITIES:

Design Execution & Technical Leadership

• Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met
• Handle multiple concurrent design programs in a fast-paced and high-pressure environment
• Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures)
• Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams

Cross-Functional Collaboration

• Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions
• Interface with stakeholders to communicate design status, risks, and mitigation strategies
• Contribute to design reviews, signoff readiness, and tapeout processes

Methodology & Continuous Improvement

• Define and enhance package design methodologies, flows, and best practices
• Drive improvements in layout efficiency, reuse, and design standardization
• Mentor junior engineers and promote engineering excellence across the team

PREFERRED EXPERIENCE:

• Experience in designing complex substrate design or Silicon Bridge or Interposers
• Proven ability to execute in multi-project, fast-phased, and high-pressure environments
• Strong experience in advanced packaging technologies:
• Hands-on experience with EDA tools such as:
• Experience working with OSATs, foundries, and substrate vendors
• Solid understanding of Signal Integrity and Power Integrity fundamentals

ACADEMIC CREDENTIALS:

• Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field