6723 - Advanced Packaging Process Engineer | $8K–$10K | Admiralty | HBM, CoWoS & Flip Chip

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. is recruiting a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) for Singapore Admiralty.

The role focuses on customer packaging roadmaps, translating requirements into equipment specs and supporting technical demonstrations. Strong experience in TCB, 2.5D/3D packaging, and NPI is essential. Applicants should have a minimum of five years in semiconductor packaging, with hands-on TCB and related technologies, and a background in

Qualifications

• - Bachelor's or Master's Degree in one of the listed engineering disciplines.
• - Minimum 5 years of experience in semiconductor advanced packaging.
• - Hands-on experience with TCB and related packaging technologies.
• - Knowledge of AI accelerator packaging or heterogeneous integration is a plus.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving Thermo Compression Bonding (TCB) and related packaging.
• Evaluate and optimize bond force, temperature profiles, process windows, and alignment.
• Work with multidisciplinary teams to define machine architecture and specifications.
• Provide guidance throughout equipment development and qualification.

Skills

Thermo Compression Bonding

Advanced Packaging

Flip Chip Assembly

New Product Introduction

Process Qualification

Equipment Qualification

Manufacturing Engineering

Customer Process Development

HBM

CoWoS

CoPoS

Chiplets

2.5D Packaging

3D Packaging

Large Die Packaging

TCB Equipment Knowledge

Education

Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Semiconductor Engineering

Related Engineering Disciplines

Job description

Position title: Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB)

Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

-Develop and support applications involving:

• Thermo Compression Bonding (TCB)
• Flip Chip Assembly
• Hybrid Bonding
• HBM Packaging
• CoWoS
• CoPoS
• 2.5D Packaging
• 3D Packaging
• Chiplet Integration
• Large Die Packaging

-Evaluate and optimize:

• Bond force
• Temperature profiles
• Process windows
• Alignment accuracy
• Package warpage
• Yield
• Reliability

Equipment Development

-Work closely with multidisciplinary engineering teams to define:

• Machine architecture
• Functional specifications
• Accuracy requirements
• Throughput targets
• Thermal performance
• Bonding process capability
• Reliability requirements
• Customer acceptance criteria

Provide technical guidance throughout equipment development.

Machine Qualification

Serve as the internal customer during equipment development.

Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

Monitor industry developments in:

• Advanced packaging technologies
• Semiconductor manufacturing trends
• Customer requirements
• Competitor equipment
• Emerging packaging architectures

Support future product strategy and technology roadmap planning.

Requirements

- Bachelor's or Master's Degree in:

• Materials Engineering
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
• Semiconductor Engineering
• Related Engineering disciplines

-Minimum5 yearsexperience in semiconductor advanced packaging.

-Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)
• Advanced Packaging Process Development
• Flip Chip Assembly
• New Product Introduction (NPI)
• Process Qualification
• Equipment Qualification
• Manufacturing Engineering
• Customer Process Development

- Experience supporting advanced package technologies such as:

• HBM
• CoWoS
• CoPoS
• Chiplets
• 2.5D Packaging
• 3D Packaging
• Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

• Thermo Compression Bonding (TCB)
• Semiconductor Packaging
• Flip Chip Assembly
• Process Qualification
• SPC
• DOE
• Yield Improvement
• Reliability Testing
• Failure Analysis
• Package Warpage
• Thermal Management
• Alignment Accuracy
• Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.