Advanced Packaging Engineer - 2.5D/3DIC & OSAT

United Microelectronics Corporation (Singapore Branch); Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

United Microelectronics Corporation (Singapore Branch) is seeking an OSAT & Advanced Packaging Engineer to drive advanced packaging with external OSAT partners in Singapore. You will focus on 2.5D/3D packaging platform technologies, develop bumping, underfill, molding and RDL processes, and ensure timely product delivery.

The role requires 2+ years in OSAT R&D/Packaging, a relevant bachelor’s degree, strong English, and hands-on experience with FMEA, DOE, and process verification.

Qualifications

• Bachelor-level engineering degree in Electronics, Electrical, Physics, Materials or related field.
• 2+ years in OSAT R&D / Packaging / Process engineering or related.
• Proficient in English (verbal and written).

Responsibilities

• Work on 2.5D/3D packaging platform technologies.
• Develop bump, underfill, molding and RDL processes.
• Collaborate with internal R&D and OSAT partners to drive heterogeneous integration.
• Perform new advanced packaging process verification and qualification.
• Engage with customers for new product verification.

Skills

2.5D/3DIC process development

Bumping/Molding/Dicing/Bonding

RDL/interconnect technologies

FMEA & DOE

English communication

Education

Bachelor's degree in Electronics / Electrical / Physics / Materials Engineering or related field

Job description

United Microelectronics Corporation (Singapore Branch) is seeking an OSAT & Advanced Packaging Engineer to drive advanced packaging with external OSAT partners in Singapore. You will focus on 2.5D/3D packaging platform technologies, develop bumping, underfill, molding and RDL processes, and ensure timely product delivery.

The role requires 2+ years in OSAT R&D/Packaging, a relevant bachelor’s degree, strong English, and hands-on experience with FMEA, DOE, and process verification.