6723 - Advanced Packaging Application Engineer | Up to $10K | Admiralty | TCB & CoWoS

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) in Admiralty, Singapore.

The role focuses on customer engineering, process development, and equipment qualification for advanced packaging technologies including TCB, flip chip, and 2.5D/3D concepts. You will work with multidisciplinary teams, evaluate process windows, and drive reliability, yield, and package warpage improvements while supporting product strategy and

Qualifications

• - Experience in Thermo Compression Bonding (TCB) and advanced packaging processes.
• - Knowledge of flip chip assembly, 2.5D/3D packaging, and HBM/CoWoS integration.
• - Familiarity with DOE, SPC, and yield improvement techniques.
• - Ability to define machine acceptance criteria and participate in FAT/SAT.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Skills

TCB (Thermo Compression Bonding)

Advanced Packaging

Flip Chip Assembly

NPI

Process Qualification

Equipment Qualification

Manufacturing Engineering

Yield Improvement

Reliability Testing

Failure Analysis

Package Warpage

Thermal Management

Alignment Accuracy

Semiconductor Manufacturing

Education

Bachelor's or Master's Degree in Materials Engineering

Bachelor's or Master's Degree in Mechanical Engineering

Bachelor's or Master's Degree in Electrical Engineering

Bachelor's or Master's Degree in Chemical Engineering

Bachelor's or Master's Degree in Physics

Bachelor's or Master's Degree in Semiconductor Engineering

Related Engineering disciplines

Tools

ASMPT

BESI

Toray

Panasonic

Kulicke & Soffa

Job description

Position title: Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB)

Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

-Develop and support applications involving:

• Thermo Compression Bonding (TCB)
• Flip Chip Assembly
• Hybrid Bonding
• HBM Packaging
• CoWoS
• CoPoS
• 2.5D Packaging
• 3D Packaging
• Chiplet Integration
• Large Die Packaging

-Evaluate and optimize:

• Bond force
• Temperature profiles
• Process windows
• Alignment accuracy
• Package warpage
• Yield
• Reliability

Equipment Development

-Work closely with multidisciplinary engineering teams to define:

• Machine architecture
• Functional specifications
• Accuracy requirements
• Throughput targets
• Thermal performance
• Bonding process capability
• Reliability requirements
• Customer acceptance criteria

Provide technical guidance throughout equipment development.

Machine Qualification

Serve as the internal customer during equipment development.

Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

Monitor industry developments in:

• Advanced packaging technologies
• Semiconductor manufacturing trends
• Customer requirements
• Competitor equipment
• Emerging packaging architectures

Support future product strategy and technology roadmap planning.

Requirements

- Bachelor's or Master's Degree in:

• Materials Engineering
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
• Semiconductor Engineering
• Related Engineering disciplines

-Minimum5 yearsexperience in semiconductor advanced packaging.

-Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)
• Advanced Packaging Process Development
• Flip Chip Assembly
• New Product Introduction (NPI)
• Process Qualification
• Equipment Qualification
• Manufacturing Engineering
• Customer Process Development

- Experience supporting advanced package technologies such as:

• HBM
• CoWoS
• CoPoS
• Chiplets
• 2.5D Packaging
• 3D Packaging
• Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

• Thermo Compression Bonding (TCB)
• Semiconductor Packaging
• Flip Chip Assembly
• Process Qualification
• SPC
• DOE
• Yield Improvement
• Reliability Testing
• Failure Analysis
• Package Warpage
• Thermal Management
• Alignment Accuracy
• Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.