Senior Advanced Packaging / TCB Process Engineer (Semiconductor / Up to 10k) - 8890

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is hiring a Senior Advanced Packaging Application Engineer focused on Thermo Compression Bonding (TCB) for cutting-edge 2.5D/3D packaging, CoWoS, and HBM applications.

You will work with cross-functional teams to translate customer requirements into robust packaging solutions and guide new equipment development. You will evaluate process windows, bonding performance, and reliability, while collaborating with customers and suppliers to deliver state-of-the-art

Qualifications

• Bachelor's or Master's Degree in Materials Engineering, Mechanical, Electrical, Chemical, Physics, Semiconductor Engineering or related fields.
• Minimum 5 years of experience in semiconductor advanced packaging.
• Hands-on experience in TCB, Advanced Packaging Process Development, Flip Chip Assembly, NPI, Process Qualification, Equipment Qualification, Manufacturing Engineering, and Customer Process Development.
• Experience with advanced packaging tech such as HBM, CoWoS, CoPoS, Chiplets, 2.5D/3D Packaging, Large Die Packaging.
• Knowledge of TCB equipment from leading manufacturers is advantageous.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving Thermo Compression Bonding, Flip Chip Assembly, Hybrid Bonding, HBM, CoWoS, CoPoS, 2.5D/3D Packaging, Chiplet Integration and Large Die Packaging.
• Evaluate and optimize bond force, temperature profiles, process windows and alignment accuracy.
• Provide technical guidance throughout equipment development and act as internal customer during equipment qualification.

Skills

TCB

Advanced Packaging

NPI

Process Qualification

Equipment Qualification

Manufacturing Engineering

Customer Process Development

Reliability Testing

Education

Bachelor's or Master's Degree in Materials/Mechanical/Electrical/Chemical Engineering, Physics or Semiconductor Engineering

Tools

ASMPT

BESI

Toray

Panasonic

Kulicke & Soffa

Job description

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) | HBM | CoWoS | 2.5D/3D Packaging | Flip Chip | Advanced Semiconductor Packaging | Process Development

• Location: Admirax St
• Working Days: 5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability)

Responsibilities:

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

- Develop and support applications involving:

• Thermo Compression Bonding (TCB)
• Flip Chip Assembly
• Hybrid Bonding
• HBM Packaging
• CoWoS
• CoPoS
• 2.5D Packaging
• 3D Packaging
• Chiplet Integration
• Large Die Packaging

- Evaluate and optimize:

• Bond force
• Temperature profiles
• Process windows
• Alignment accuracy
• Package warpage
• Yield
• Reliability

Equipment Development

- Work closely with multidisciplinary engineering teams to define:

• Machine architecture
• Functional specifications
• Accuracy requirements
• Throughput targets
• Thermal performance
• Bonding process capability
• Reliability requirements
• Customer acceptance criteria

- Provide technical guidance throughout equipment development.

Machine Qualification

- Serve as the internal customer during equipment development.

- Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

- Monitor industry developments in:

• Advanced packaging technologies
• Semiconductor manufacturing trends
• Customer requirements
• Competitor equipment
• Emerging packaging architectures

- Support future product strategy and technology roadmap planning.

Requirements:

- Bachelor's or Master's Degree in:

• Materials Engineering
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
• Semiconductor Engineering
• Related Engineering disciplines

- Minimum5 yearsexperience in semiconductor advanced packaging.

- Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)
• Advanced Packaging Process Development
• Flip Chip Assembly
• New Product Introduction (NPI)
• Process Qualification
• Equipment Qualification
• Manufacturing Engineering
• Customer Process Development

- Experience supporting advanced package technologies such as:

• HBM
• CoWoS
• CoPoS
• Chiplets
• 2.5D Packaging
• 3D Packaging
• Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

• Thermo Compression Bonding (TCB)
• Semiconductor Packaging
• Flip Chip Assembly
• Process Qualification
• SPC
• DOE
• Yield Improvement
• Reliability Testing
• Failure Analysis
• Package Warpage
• Thermal Management
• Alignment Accuracy
• Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.