Process Engineer Section Manager

onsemi; Lapu-Lapu; On-site; PHP 4,810,583 - 6,614,551; Full time

Job summary

A leading semiconductor company located in the Philippines is seeking an Engineering Manager to lead the FOL Process Engineering organization. This role will drive continuous improvement initiatives and ensure compliance with quality standards in a high-complexity environment. The ideal candidate should have over 8 years of experience in semiconductor assembly and strong leadership skills in managing cross-functional teams. This is a unique opportunity to make a significant impact on production processes while contributing to innovative technologies.

Qualifications

• 8+ years in semiconductor assembly (Die Attach / Wire Bond).
• Proven leadership in high-mix, high-complexity FOL operations.
• Demonstrated capability in yield improvement and process governance.

Responsibilities

• Lead engineering responses to yield losses and quality issues.
• Oversee execution of Continuous Improvement Plan and productivity projects.
• Ensure audit readiness and compliance with standards.

Skills

Technical mastery in FOL processes

Excellent analytical skills

Problem-solving

Leadership

Communication

Education

Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field)

Tools

Minitab

Exensio

Job description

Overview

Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).

Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.

Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.

Reporting Relationship

• Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.

Responsibilities

• Provide strategic process ownership for all FOL Package Group (SPC governance, PFMEA/Control Plan, recipe management, process capability Ppk, documentation).
• Lead engineering responses to yield losses, top defect contributors, customer complaints, reliability audit failures, and GMRB cases.
• Oversee execution of Continuous Improvement Plan, productivity projects, and proliferation activities across CBSM, SOSM, and PPD packages.
• Ensure audit readiness (IATF/ISO/Customer), compliance to change control, and cross‑functional alignment with Production, Quality, Equipment, NPI, Planning, and SQE.
• Develop technical talent, strengthen process ownership, and balance engineering workload.

Qualifications

• Education
• Bachelor’s degree in Engineering (Mechanical, Electronics, Chemical, or related field).
• Experience
• 8+ years in semiconductor assembly (Die Attach / Wire Bond), with proven leadership in high‑mix, high‑complexity FOL operations.
• Demonstrated capability in yield improvement, DOE, SPC, PFMEA/Control Plan, and equipment/materials qualification.
• Skills & Knowledge Requirements
• Strong technical mastery in FOL processes (DA, WB, Clip Attach, Plasma) and failure mechanisms.
• Excellent analytical skills (Minitab/Exensio/SPC), problem‑solving (8D, DMAIC), and audit/customer‑facing communication.
• Ability to lead teams, manage cross‑functional escalations, and sustain process governance under high‑volume/high‑complexity environments

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.