Senior Die Attach Process Engineer – Clip Attach

onsemi

Lapu-Lapu

On-site

PHP 900,000 - 1,300,000

Full time

4 days ago

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Job summary

onsemi in the Philippines is seeking a Die Attach / Clip Attach Engineer to own, develop, and sustain solder die attach and clip attach processes, ensuring stable yields, high equipment uptime, and compliance with reliability and customer requirements.

You will lead cross-functional teams across Production, Quality, Planning, and NPI to drive CAPAs, DOE studies, and process improvements for NPI ramp and high-volume manufacturing, leveraging DMAIC, PFMEA, and SPC methodologies.

Qualifications

10+ years of semiconductor manufacturing experience with ≥8 years in solder die attach/clip attach for module packages.
Hands-on with die bonders/reflow platforms (ASM, ESEC or equivalent) and high-mix, high-reliability products.
Proven track record in capability studies (Cp/Cpk) and DOE.

Responsibilities

Own, sustain and optimize die attach process parameters and tooling.
Lead PFMEA, Control Plans, WI, and process documentation; drive process capability and performance (Ppk).
Improve yield and quality through DOE, DOEs, and root cause analysis.
Ensure compliance with audits and change control; prepare evidence for customer audits.
Collaborate cross-functionally with Production, Quality, PE, NPI, Planning, and SQE to meet OEE, quality, and delivery goals.