Senior Packaging Architect – HPC AI Power Modules

Infineon Technologies AG; Muntinlupa; Presencial; PHP 900.000 - 1.300.000; Jornada completa

Descripción de la vacante

Infineon Technologies AG seeks a seasoned packaging engineer to develop and define package concepts for AI HPC modules. You will validate ideas with simulations and hardware demos, working closely with Back-End development, product development, and system architects to ensure robust assembly paths.

You will coordinate with internal teams and OSAT partners, launching assembly projects and tracking them through release. Strong leadership in packaging, reliability, and market awareness is essential.

Formación

• Bachelor's degree in Engineering with ~7+ years in assembly technologies.
• Strong hands-on knowledge of Back-End processes and laminate design.
• Experience with SMT and PCB/module technologies; MLCC knowledge an advantage.
• Expertise in semiconductor packaging, assembly, and test with reliability engineering.
• Excellent communication skills in English, both written and spoken.

Responsabilidades

• Develop and define package concepts for AI power-supply HPC modules.
• Validate concepts via simulation and hardware demonstrators with Back-End teams.
• Coordinate with internal teams and OSAT partners to launch assembly projects.
• Track development projects through to final product release.
• Define package characteristics to meet electrical, thermal, mechanical, and reliability requirements.
• Serve as technical interface to partners and consultants on package definition throughout the project lifecycle.

Conocimientos

Back-End processes

SMT

PCB/module technologies

MLCCs

AutoCAD

3D drafting

English communication

Educación

Bachelor's degree in Engineering

Herramientas

AutoCAD

3D drafting

Descripción del empleo

Infineon Technologies AG seeks a seasoned packaging engineer to develop and define package concepts for AI HPC modules. You will validate ideas with simulations and hardware demos, working closely with Back-End development, product development, and system architects to ensure robust assembly paths.

You will coordinate with internal teams and OSAT partners, launching assembly projects and tracking them through release. Strong leadership in packaging, reliability, and market awareness is essential.