Senior Semiconductor Packaging Architect

Nexperia; Cabuyao; On-site; PHP 1,200,000 - 1,800,000; Full time

Benefits offered by this job

Competitive salary

Professional development

Safety-focused workplace

Dynamic environment

Job summary

Nexperia, a leading semiconductor company, seeks a Package Architect to drive development, qualification, and implementation of new packaging technologies. You will collaborate with manufacturing sites, subcontractors, and cross-functional teams to deliver robust packaging solutions while ensuring seamless integration.

The role requires hands-on experience with DOE, DFMEA, and control plans, plus strong communication and leadership skills.

Qualifications

• Bachelor's degree in engineering or related discipline.
• Strong knowledge of semiconductor packaging processes and materials.
• Hands-on experience with DOE, DFMEA/PFMEA, and control plans.
• Experience with subcontractors in semiconductor manufacturing is preferred.
• Excellent communication and problem-solving skills.

Responsibilities

• Develop and introduce new semiconductor package technologies and materials.
• Collaborate with internal sites, subcontractors, and cross-functional teams.
• Evaluate subcontractors through RFQs and technical assessments.
• Lead risk assessments for package and process integration.
• Review DOEs and mitigation plans to ensure robust development.
• Monitor qualification plans and drive IP generation.
• Perform failure analysis and implement corrective actions.
• Prepare technical reports and engineering documentation.
• Travel within Asia and occasionally Europe to support projects.

Skills

Semiconductor packaging

Project management

Cross-functional leadership

Supplier evaluation

Quality methodologies

Communication skills

Data analysis

Education

Bachelor's degree in engineering

Tools

JMP

Minitab

Statistica

Job description

Nexperia, a leading semiconductor company, seeks a Package Architect to drive development, qualification, and implementation of new packaging technologies. You will collaborate with manufacturing sites, subcontractors, and cross-functional teams to deliver robust packaging solutions while ensuring seamless integration.

The role requires hands-on experience with DOE, DFMEA, and control plans, plus strong communication and leadership skills.