Senior Packaging & Assembly Project Engineer

Allegro MicroSystems, LLC

Parañaque

On-site

PHP 1,004,000 - 1,674,000

Full time

14 days+

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Job summary

Allegro MicroSystems, LLC is seeking a Senior Project Engineer to lead semiconductor packaging projects, drive design and process decisions, and ensure delivery within scope, schedule, and budget. You will manage BOMs, develop qualification plans, and collaborate with diverse teams globally to meet stringent quality standards.

The role requires 3–5 years in packaging/assembly engineering, strong project management, and expertise with quality tools.

Qualifications

  • Bachelor's degree in engineering (Mechanical, Chemical, or Electrical).
  • 3–5 years in semiconductor packaging/assembly engineering.
  • Experience in technical project management and decision-making.

Responsibilities

  • Independently manage and execute assigned packaging projects, ensuring completion on time, within budget, and within scope.
  • Serve as a packaging and assembly expert, making design and process decisions and supporting assembly engineering activities.
  • Create and refine bonding diagrams, ensuring adherence to Allegro's design rules.
  • Lead bill of materials selection, optimizing for performance, cost, and manufacturability.
  • Develop, execute, and oversee comprehensive qualification planning and execution.
  • Perform in-depth assembly data review and qualification data review, driving corrective actions and continuous improvement.
  • Track critical tasks and milestones, identify delays, and implement corrective actions.
  • Identify, document, and elevate project risks to the Technical Project Manager with proposed solutions.
  • Collaborate with design, product lines, manufacturing, and quality teams to drive project execution.
  • Ensure all deliverables adhere to AQP requirements and internal documentation procedures.
  • Lead or participate in Ishikawa/8D analyses when issues arise.
  • Demonstrate proficiency with DFMEA, PFMEA, Ishikawa, DRBFM, DFM, DfQ, and DfCost.
  • Contribute to managing Allegro's package design rules.
  • Maintain comprehensive project documentation including schedules, budgets, and specs.

Skills

Packaging engineering
Project management
Quality mindset
English fluency
Analytical skills

Education

Bachelor’s degree in Engineering

Tools

Excel
PowerPoint
DFMEA
PFMEA
Ishikawa

Job description

Allegro MicroSystems, LLC is seeking a Senior Project Engineer to lead semiconductor packaging projects, drive design and process decisions, and ensure delivery within scope, schedule, and budget. You will manage BOMs, develop qualification plans, and collaborate with diverse teams globally to meet stringent quality standards.

The role requires 3–5 years in packaging/assembly engineering, strong project management, and expertise with quality tools.

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