Senior Power Packaging Engineer for High-Performance Modules

Renesas Electronics Corp.; Pasig; On-site; PHP 2,000,000 - 4,200,000; Full time

Job summary

Renesas Electronics Corp. in the Philippines seeks a senior technical contributor to design, develop and resolve issues on advanced high-power packages for power semiconductors.

You will collaborate globally with Design, Assembly, Test, Reliability, Quality, Sales, Marketing, and OSATs to ensure robust, cost-effective and manufacturable solutions. The role requires 15+ years in semiconductor packaging, experience with multi-die configurations, DoEs, thermo-mechanical analysis, and project

Qualifications

• BS Degree in Electrical, Mechanical, or Material Science.
• Minimum 15 years in semiconductor packaging technology with DFM / package development experience.
• Excellent leadership and OSAT management experience.
• Experience with power discrete products, multi-die and stacked-die configurations.
• Experience with packaging design rules, tools (AutoCAD) and related simulations.

Responsibilities

• Design and develop advanced high power discrete and module packages.
• Define package design rules, process flow and material set for new products.
• Analyze stress, thermal, and electrical performance with thermo-mechanical knowledge.
• Define BOM, assembly process development, and qualification per standards.
• Run DOEs to optimize process windows and material characteristics.
• Resolve reliability and assembly issues with OSATs across Asia.
• Collaborate with device design and external packaging vendors for qualification.
• Plan reliability testing and qualification per JEDEC/IPC and automotive standards.
• Drive project management across core technology projects and transitions to production.
• Share NPI knowledge with sustaining teams to ensure smooth production transfer.

Skills

Power packaging

OSAT management

Multi-die stacking

AutoCAD

Thermal analysis

DOE

Process capability

Project management

High voltage packaging

English proficiency

Education

Electrical Engineering

Mechanical Engineering

Material Science

Tools

SAS/JMP/Minitab

Thermos-mechanical software

Job description

Renesas Electronics Corp. in the Philippines seeks a senior technical contributor to design, develop and resolve issues on advanced high-power packages for power semiconductors.

You will collaborate globally with Design, Assembly, Test, Reliability, Quality, Sales, Marketing, and OSATs to ensure robust, cost-effective and manufacturable solutions. The role requires 15+ years in semiconductor packaging, experience with multi-die configurations, DoEs, thermo-mechanical analysis, and project