Senior Power Packaging Engineer — Multichip & High Reliability

Renesas Electronics Corp.; Carmen; On-site; PHP 1,500,000 - 2,100,000; Full time

Benefits offered by this job

Competitive benefits package

Job summary

Renesas Electronics Corp. is seeking a senior technical contributor to design, develop, and resolve issues on advanced power semiconductor packages.

You will collaborate across Design, Assembly, Test, Reliability, Quality, Sales, Marketing and OSATs to drive high reliability, low cost and mass production readiness. You will lead packaging design, define rules, perform stress and thermal analyses, and drive qualification plans in line with JEDEC/IPC automotive standards.

Qualifications

• BS degree in Electrical, Mechanical or Materials Science.
• 15+ years of semiconductor packaging experience with DFM/Package Development.
• Experience leading OSAT engagements and supplier management.
• Power discrete, multi-die, stacked die packaging experience.

Responsibilities

• Design and develop advanced high-power packaging solutions.
• Define package design rules, process flows and materials set for new products.
• Analyze stress, thermal, and electrical performance of packages.

Skills

Packaging design

Project management

OSAT collaboration

SAS/JMP/Minitab

Education

BS in Electrical Engineering

BS in Mechanical Engineering

BS in Materials Science

Tools

AutoCAD

SAS/JMP/Minitab

Job description

Renesas Electronics Corp. is seeking a senior technical contributor to design, develop, and resolve issues on advanced power semiconductor packages.

You will collaborate across Design, Assembly, Test, Reliability, Quality, Sales, Marketing and OSATs to drive high reliability, low cost and mass production readiness. You will lead packaging design, define rules, perform stress and thermal analyses, and drive qualification plans in line with JEDEC/IPC automotive standards.