Senior Staff Engineer Module Package Development

Infineon Technologies AG; Muntinlupa; On-site; PHP 900,000 - 1,300,000; Full time

Job summary

Infineon Technologies AG seeks a seasoned packaging engineer to develop and define package concepts for AI HPC modules. You will validate ideas with simulations and hardware demos, working closely with Back-End development, product development, and system architects to ensure robust assembly paths.

You will coordinate with internal teams and OSAT partners, launching assembly projects and tracking them through release. Strong leadership in packaging, reliability, and market awareness is essential.

Qualifications

• Bachelor's degree in Engineering with ~7+ years in assembly technologies.
• Strong hands-on knowledge of Back-End processes and laminate design.
• Experience with SMT and PCB/module technologies; MLCC knowledge an advantage.
• Expertise in semiconductor packaging, assembly, and test with reliability engineering.
• Excellent communication skills in English, both written and spoken.

Responsibilities

• Develop and define package concepts for AI power-supply HPC modules.
• Validate concepts via simulation and hardware demonstrators with Back-End teams.
• Coordinate with internal teams and OSAT partners to launch assembly projects.
• Track development projects through to final product release.
• Define package characteristics to meet electrical, thermal, mechanical, and reliability requirements.
• Serve as technical interface to partners and consultants on package definition throughout the project lifecycle.

Skills

Back-End processes

SMT

PCB/module technologies

MLCCs

AutoCAD

3D drafting

English communication

Education

Bachelor's degree in Engineering

Tools

AutoCAD

3D drafting

Job description

Develop and define package concepts for AI power-supply products, with an emphasis on High-Performance Computing (HPC) modules. Validate proposed package concepts through simulation and hardware demonstrators, working closely with Back-End development, product development, and system architects.

Coordinate and align new package concepts with Back-End development teams, including internal teams and OSAT partners, and launch required assembly projects. Track and support package development projects through to final product release.

Identify emerging development needs and translate them into additions or updates to the package roadmap. Serve as the technical point of contact for customer questions related to semiconductor packaging. Stay current on packaging solutions by continuously monitoring market trends and conducting competitor benchmarking.

Identify and assess business opportunities created by new technologies and innovative packaging concepts. Lead the technical definition for major and new package projects, including BOM, package design, assembly technology selection, PRP reviews, and project classification, as well as risk and impact assessment.

Define package characteristics that satisfy electrical, thermal, mechanical, and reliability requirements. Act as a key technical interface to partners and technical consultants on package definition, particularly in Back-End assembly technology.

Support pre-development and project definition activities, and serve as the packaging design expert throughout the full project lifecycle.

Bachelor's degree in Engineering (e.g., Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Applied Physics) with ~7+ years of relevant experience in assembly technologies.

Strong hands-on knowledge of Back-End processes, materials, and interdependencies (including laminate design, materials, and manufacturing processes). Working knowledge of SMT, PCB/module-related technologies and Mechanical Additional knowledge of passive components, including MLCCs, is an advantage.

Expertise in semiconductor packaging, assembly, and test. Experience with failure analysis and reliability engineering. Strong analytical, statistical (JMP, Minitab), and structured problem-solving skills.

AutoCAD and 3D drafting skills preferred. Excellent communication and presentation skills, must be able to communicate effectively English both verbally and in writing.

We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience.

Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.