Senior Packaging Project Engineer: Drive Innovative Chip Packaging

Allegro MicroSystems, LLC

Hinoba-an

Sur place

PHP 5 643 000 - 8 777 000

Plein temps

14 jours+

Obtenez une réponse de cet employeur

Votre CV et votre lettre de motivation, adaptés exactement à ce que l’employeur recherche.

Passez les filtres ATS

Résumé du poste

Allegro MicroSystems, LLC is seeking a Senior Project Engineer to drive packaging and assembly initiatives. You will lead projects from concept to qualification, collaborating with design, product lines, manufacturing, and quality teams to ensure on-time delivery and strict quality standards.

The role emphasizes decision-making on package design, process engineering, and adherence to DFMEA, PFMEA, and AQP practices, with opportunities to mentor junior engineers and influence packaging design

Qualifications

  • Bachelor's degree in an engineering field as listed.
  • 3–5 years of semiconductor packaging and assembly engineering experience.
  • Proven track record in technical project management and decision-making.
  • Strong understanding of project management principles and technical leadership.

Responsabilités

  • Independently manage packaging projects, delivering on time, budget, and scope.
  • Act as packaging and assembly expert, guiding design and process decisions.
  • Create and refine bonding diagrams and contribute to design rules evolution.
  • Lead BOM selection, optimizing performance, cost, and manufacturability.
  • Develop and oversee qualification planning and execution.
  • Perform data reviews and drive corrective actions and continuous improvement.
  • Track tasks and milestones, addressing delays with corrective actions.
  • Identify risks and resource conflicts and propose solutions to PM.
  • Collaborate with design, product lines, manufacturing, and quality teams.
  • Ensure adherence to AQP requirements and proper documentation.
  • Lead or participate in Ishikawa/8D analyses for issues.
  • Maintain project documentation including schedules and budgets.

Connaissances

Packaging engineering
Project management
Quality tools
DFMEA
PFMEA
Ishikawa
DRBFM
Design for Manufacturability
Design for Quality
Design for Cost
AQP

Formation

Bachelor's degree in Mechanical Engineering
Bachelor's degree in Chemical Engineering
Bachelor's degree in Electrical Engineering

Outils

Excel
PowerPoint

Description du poste

Allegro MicroSystems, LLC is seeking a Senior Project Engineer to drive packaging and assembly initiatives. You will lead projects from concept to qualification, collaborating with design, product lines, manufacturing, and quality teams to ensure on-time delivery and strict quality standards.

The role emphasizes decision-making on package design, process engineering, and adherence to DFMEA, PFMEA, and AQP practices, with opportunities to mentor junior engineers and influence packaging design

Obtenez votre examen gratuit et confidentiel de votre CV.

ou faites glisser et déposez votre fichier ici.

Similar jobs

Postes similaires à comparer

Senior Packaging & Assembly Project Engineer
Senior Packaging & Assembly Project Engineer

Allegro MicroSystems, LLC • Parañaque

Sur place
PHP 1 004 000 - 1 674 000
Senior Packaging Project Engineer – Drive Innovation and Quality
Senior Packaging Project Engineer – Drive Innovation and Quality

Allegro Microsystems Philippines Inc. • Parañaque

Sur place
PHP 600 000 - 1 000 000
Lead Engineer, Packaging Project
Lead Engineer, Packaging Project

Allegro Microsystems Philippines Inc. • Parañaque

Sur place
PHP 600 000 - 1 000 000
Lead Engineer, Packaging Project
Lead Engineer, Packaging Project

Allegro MicroSystems, LLC • Hinoba-an

Sur place
PHP 5 643 000 - 8 777 000
Lead Engineer, Packaging Project
Lead Engineer, Packaging Project

Allegro MicroSystems, LLC • Parañaque

Sur place
PHP 1 004 000 - 1 674 000
Senior Semiconductor Packaging Architect
Senior Semiconductor Packaging Architect

Nexperia • Cabuyao

Sur place
PHP 1 200 000 - 1 800 000
Competitive salary
Professional development
Safety-focused workplace
+1
Senior Package Process Engineer - Die & Packaging Innovation
Senior Package Process Engineer - Die & Packaging Innovation

onsemi • Carmona

Sur place
PHP 1 800 000 - 3 200 000
Senior Power Packaging Engineer — Multichip & High Reliability
Senior Power Packaging Engineer — Multichip & High Reliability

Renesas Electronics Corp. • Carmen

Sur place
PHP 1 500 000 - 2 100 000
Competitive benefits package
Senior Hardware Engineer: Systems & PCB Design Leader
Senior Hardware Engineer: Systems & PCB Design Leader

Allegro Microsystems Philippines Inc. • Muntinlupa

Sur place
PHP 1 000 000 - 1 400 000
Senior Packaging Architect – HPC AI Power Modules
Senior Packaging Architect – HPC AI Power Modules

Infineon Technologies AG • Muntinlupa

Sur place
PHP 900 000 - 1 300 000