Lead, Next-Gen AI/HPC Semiconductor Packaging

Infineon Technologies Philippines, Inc.; Muntinlupa; On-site; PHP 1,200,000 - 1,800,000; Full time

Job summary

Infineon Technologies Philippines, Inc. in Metro Manila seeks a Senior Staff Engineer to shape AI power-supply and HPC packaging concepts. You will lead package definition from concept to product release, coordinating with Back-End, OSAT partners, simulations, reliability teams, and product developers.

You will validate concepts via simulations and hardware demonstrators, align with internal teams, and drive the package roadmap while monitoring market trends and opportunities.

Qualifications

• Bachelor’s degree in Engineering with 7+ years of relevant experience in assembly technologies.
• Strong hands-on knowledge of Back-End processes, materials, and interdependencies (laminate design, materials, and manufacturing processes).
• Expertise in semiconductor packaging, assembly, and test; experience with failure analysis and reliability engineering.

Responsibilities

• Develop and define package concepts for AI power-supply products, emphasizing HPC modules.
• Validate proposed concepts through simulation and hardware demonstrators with Back-End and OSAT partners.
• Coordinate and align new package concepts with Back-End development teams and launch required assembly projects.
• Track and support package development projects through to final product release.
• Identify emerging development needs and translate them into updates to the package roadmap.
• Serve as the technical contact for customer questions related to semiconductor packaging.

Skills

Semiconductor packaging

Back-End assembly

Reliability engineering

Statistical analysis

AutoCAD / 3D drafting

Communication skills

Education

Bachelor’s degree in Engineering

Tools

JMP

Minitab

AutoCAD

Job description

Infineon Technologies Philippines, Inc. in Metro Manila seeks a Senior Staff Engineer to shape AI power-supply and HPC packaging concepts. You will lead package definition from concept to product release, coordinating with Back-End, OSAT partners, simulations, reliability teams, and product developers.

You will validate concepts via simulations and hardware demonstrators, align with internal teams, and drive the package roadmap while monitoring market trends and opportunities.