Senior Staff Engineer Module Package Development 11 days ago

Infineon Technologies Philippines, Inc.; Muntinlupa; On-site; PHP 1,200,000 - 1,800,000; Full time

Job summary

Infineon Technologies Philippines, Inc. in Metro Manila seeks a Senior Staff Engineer to shape AI power-supply and HPC packaging concepts. You will lead package definition from concept to product release, coordinating with Back-End, OSAT partners, simulations, reliability teams, and product developers.

You will validate concepts via simulations and hardware demonstrators, align with internal teams, and drive the package roadmap while monitoring market trends and opportunities.

Qualifications

• Bachelor’s degree in Engineering with 7+ years of relevant experience in assembly technologies.
• Strong hands-on knowledge of Back-End processes, materials, and interdependencies (laminate design, materials, and manufacturing processes).
• Expertise in semiconductor packaging, assembly, and test; experience with failure analysis and reliability engineering.

Responsibilities

• Develop and define package concepts for AI power-supply products, emphasizing HPC modules.
• Validate proposed concepts through simulation and hardware demonstrators with Back-End and OSAT partners.
• Coordinate and align new package concepts with Back-End development teams and launch required assembly projects.
• Track and support package development projects through to final product release.
• Identify emerging development needs and translate them into updates to the package roadmap.
• Serve as the technical contact for customer questions related to semiconductor packaging.

Skills

Semiconductor packaging

Back-End assembly

Reliability engineering

Statistical analysis

AutoCAD / 3D drafting

Communication skills

Education

Bachelor’s degree in Engineering

Tools

JMP

Minitab

AutoCAD

Job description

Shape the future of semiconductor packaging for AI and High-Performance Computing.

We’re looking for a Senior Staff Engineer to develop next-generation package concepts for AI power-supply and HPC applications. You’ll lead package definition from concept to product release, working across

• Back-End assembly, OSAT partners, simulation, reliability, SMT and module technologies.
• If you bring deep expertise in semiconductor packaging and assembly and want to turn innovative concepts into high-performance solutions, this could be your next opportunity.
• Your role
• Key responsibilities in your new role
• Develop and define package concepts for AI power-supply products, with an emphasis on High-Performance Computing (HPC) modules.
• Validate proposed package concepts through simulation and hardware demonstrators, working closely with Back-End development, product development, and system architects.
• Coordinate and align new package concepts with Back-End development teams, including internal teams and OSAT partners, and launch required assembly projects.
• Track and support package development projects through to final product release.
• Identify emerging development needs and translate them into additions or updates to the package roadmap.
• Serve as the technical point of contact for customer questions related to semiconductor packaging.
• Stay current on packaging solutions by continuously monitoring market trends and conducting competitor benchmarking.
• Identify and assess business opportunities created by new technologies and innovative packaging concepts.

Lead the technical definition for major and new package projects, including BOM, package design, assembly technology selection, PRP reviews, and project classification, as well as risk and impact assessment.

• Define package characteristics that satisfy electrical, thermal, mechanical, and reliability requirements.
• Act as a key technical interface to partners and technical consultants on package definition, particularly in Back-End assembly technology.
• Support pre-development and project definition activities, and serve as the packaging design expert throughout the full project lifecycle.
• Your profile

Qualifications And Skills To Help You Succeed

Bachelor’s degree in Engineering (e.g., Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Applied Physics) with :7+ years of relevant experience in assembly technologies.

• Strong hands-on knowledge of Back-End processes, materials, and interdependencies (including laminate design, materials, and manufacturing processes).
• Working knowledge of SMT, PCB/module-related technologies and Mechanical
• Additional knowledge of passive components, including MLCCs, is an advantage.
• Expertise in semiconductor packaging, assembly, and test.
• Experience with failure analysis and reliability engineering.
• Strong analytical, statistical ( JMP, Minitab), and structured problem-solving skills.
• AutoCAD and 3D drafting skills preferred.
• Excellent communication and presentation skills, must be able to communicate effectively English both verbally and in writing.
• #WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

• Are you in?
• We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

• Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage apply.
• Please let your recruiter know if you need any accommodations during the interview process.
• Learn more about our various contact channels and about Diversity & Inclusion at Infineon.
• Mandy Neoh