Lead Package Development Engineer – Yield & Innovation

Allegro Microsystems Philippines Inc.; Parañaque; On-site; PHP 1,200,000 - 1,800,000; Full time

Job summary

Allegro Microsystems Philippines Inc. is seeking a Lead Engineer for Package Development with extensive experience in semiconductor packaging. The role focuses on defining test strategies, leading validation, and driving yield improvements for new products from design to production.

Autonomy and cross-functional collaboration are key to on-time releases and profitability. The candidate will oversee process/material development, equipment qualification, and cost reduction, while coordinating with

Qualifications

• 5+ years’ experience in Package Development, NPI or Sustaining role in semiconductor assembly for leadframe and substrate-based packages.
• Comprehensively perform, review and interpret mold simulations and create/recommend effective solutions to achieve optimum results.
• Review POD and tooling designs and create/recommend effective solutions to achieve design intent.
• Comprehensive knowledge of downstream and upstream Assembly processes that impact the Molding Processes and can be impacted by molding output.
• SME level knowledge on FA/Rel Assessment instruments namely CSAM, Cross Section, SEM and similar methods/tools.
• Knowledge of Design for Manufacturability, DFMEA and DRBFM or equivalent.
• Statistical methods of experimentation and their application/tools (DOE, SAS-JMP, Minitab) to improve Process and Equipment Capability.
• Knowledge and application of Core tools: Process Flow, FMEA, Control Plan, Process Specifications and Work Instructions.
• Strong communication, presentation, and training skills.

Responsibilities

• Lead process/material/product development to support new packaging projects.
• Optimize process parameters to improve yield and manufacturability.
• Source and test alternative materials to reduce costs and improve quality.
• Design and qualify jigs, fixtures, and tools to enhance machine efficiency.
• Develop cost reduction and yield improvement plans with PD and NPI teams.
• Coordinate documentation and standards for new package projects.
• Coordinate quality, manufacturability and reliability issues with customers and suppliers.
• Drive on-time product release and profitability.

Skills

Leadership

Communication skills

Training skills

People management

Education

Degree in Mechanical/Electrical / Electronics and Communication /Materials / Metallurgical / Chemical / Manufacturing / Industrial Engineering

Tools

DOE

SAS-JMP

Minitab

Job description

Allegro Microsystems Philippines Inc. is seeking a Lead Engineer for Package Development with extensive experience in semiconductor packaging. The role focuses on defining test strategies, leading validation, and driving yield improvements for new products from design to production.

Autonomy and cross-functional collaboration are key to on-time releases and profitability. The candidate will oversee process/material development, equipment qualification, and cost reduction, while coordinating with