Die Attach Process Engineer I – Innovate & Scale

Microchip Technology Inc.; Laguna; On-site; PHP 600,000 - 760,000; Full time

Job summary

Microchip Technology Inc. is seeking an Engineer I-Process – Die Attach to lead development and qualification of die attach processes for new technology platforms.

You will define process architecture, windows, and roadmaps for wafer thinning while driving innovations to meet reliability and manufacturability goals. You will collaborate with Product Development, R&D, Operations, and suppliers to transfer processes from development to high-volume manufacturing, acting as SME for Die Attach and

Qualifications

• Bachelor's degree in Electronics Engineering or related field.
• Minimum 3 years of semiconductor manufacturing experience with Die Attach.
• Experience with DOE, SPC, FMEA and Six Sigma tools.
• Ability to interpret SPC charts and process data.
• Strong communication and teamwork skills.
• Knowledge of safety and cleanroom practices.

Responsibilities

• Lead development and qualification of die attach processes for new platforms.
• Define process architecture, windows, and roadmaps for wafer thinning.
• Drive innovations for advanced package requirements and materials.
• Evaluate new die attach technologies, consumables, and equipment.
• Create process specifications, control plans, and qualification reports.
• Support ramp and initial production with manufacturing teams.
• Transfer processes from development to pilot/high-volume manufacturing.
• Serve as SME for Die Attach and stencil print processes.

Skills

Analytical skills

Problem solving

Communication skills

Teamwork

Attention to detail

Leadership

Education

Bachelor's Degree in Electronics Engineering

Tools

DOE

Minitab / JMP

SPC

FMEA

GRR

Six Sigma

MS Office

Job description

Microchip Technology Inc. is seeking an Engineer I-Process – Die Attach to lead development and qualification of die attach processes for new technology platforms.

You will define process architecture, windows, and roadmaps for wafer thinning while driving innovations to meet reliability and manufacturability goals. You will collaborate with Product Development, R&D, Operations, and suppliers to transfer processes from development to high-volume manufacturing, acting as SME for Die Attach and