Process Engineer I - Wafer Backgrind & Lamination

Microchip Technology Inc.; Laguna; On-site; PHP 350,000 - 550,000; Full time

Job summary

Microchip Technology Inc. in Laguna, Philippines, seeks an Engineer I-Process – Backgrind to lead development and qualification of wafer backgrinding and thinning for advanced packaging platforms, driving robust processes and manufacturability.

You will collaborate with Product Development, R&D, Equipment Engineering, and Operations to deliver process innovation, define specs, and support ramping into high-volume production.

Qualifications

• Bachelor’s degree in engineering or related field required.
• Minimum 3 years in semiconductor manufacturing with backgrinding experience.
• Experience with DOE, SPC, FMEA and Six Sigma tools beneficial.
• Strong analytical and teamwork abilities with good communication.

Responsibilities

• Lead development and qualification of wafer backgrinding and thinning processes.
• Define process architecture, windows, and roadmaps for thinning applications.
• Drive innovation to enable thinner wafers and improved reliability.
• Evaluate new grinding technologies, materials, and equipment.
• Develop standards for wafer thinning and handling operations.
• Lead process transfer from development to pilot and high-volume manufacturing.
• Create specifications, control plans, and qualification reports.
• Support ramp and early production with manufacturing teams.
• Be SME for wafer backgrinding and related technologies.

Skills

DOE

Minitab

SPC

FMEA

Six Sigma

Analytical skills

Teamwork

Communication

Problem-solving

Detail-oriented

Education

Bachelor's Degree in Electronics Engineering

Tools

MS Office

Maintenance Mgmt Systems

Job description

Microchip Technology Inc. in Laguna, Philippines, seeks an Engineer I-Process – Backgrind to lead development and qualification of wafer backgrinding and thinning for advanced packaging platforms, driving robust processes and manufacturability.

You will collaborate with Product Development, R&D, Equipment Engineering, and Operations to deliver process innovation, define specs, and support ramping into high-volume production.