Die Attach Process Tech: Precision, Quality & Innovation

STMicroelectronics; Calamba; On-site; PHP 360,000 - 600,000; Full time

Job summary

STMicroelectronics is seeking an engineer to support development and validation of die attach processes for new bricks. You will load materials, program recipes, and operate die attach machines for LGA, BGA, QFN and flip chip packages, ensuring quality and process reliability.

The role requires 1–3 years in a semiconductor manufacturing environment, familiarity with pick-and-place systems, dispensing mechanisms, and inspection equipment, plus a willingness to work rotating shifts.

Qualifications

• Associate degree or technical/vocational diploma in electronics, mechanical engineering, or related field.
• 1–3 years of experience in a die attach process in semiconductor manufacturing.
• Familiarity with pick-and-place systems, dispensing mechanisms, and microscopic inspection.

Responsibilities

• Load materials, configure recipes, and run die attach machines per work instructions. Create die attach recipe for new process bricks for LGA, BGA, QFN and flip chip package.
• Process Monitoring: resolve major process issues using relevant tools in coordination with the local team.
• Quality Management: ensure proactive quality compliance; identify root causes and implement corrective actions to achieve customer satisfaction.
• Troubleshooting: identify and resolve machine errors and implement corrective actions to reduce scrap.
• Statistical analysis: support DOE activities, setup runs, and data gathering for new process bricks.

Skills

Die attach process

Semiconductor manufacturing

MS Office

Inspection equipment knowledge

Education

Associate degree or technical/vocational diploma

Tools

ESEC 2100

ASM 8912

ASM838

Datacon

Stencil printing equipment

Job description

STMicroelectronics is seeking an engineer to support development and validation of die attach processes for new bricks. You will load materials, program recipes, and operate die attach machines for LGA, BGA, QFN and flip chip packages, ensuring quality and process reliability.

The role requires 1–3 years in a semiconductor manufacturing environment, familiarity with pick-and-place systems, dispensing mechanisms, and inspection equipment, plus a willingness to work rotating shifts.