NPI Die Attach Process Technician

STMicroelectronics; Calamba; On-site; PHP 360,000 - 600,000; Full time

Job summary

STMicroelectronics is seeking an engineer to support development and validation of die attach processes for new bricks. You will load materials, program recipes, and operate die attach machines for LGA, BGA, QFN and flip chip packages, ensuring quality and process reliability.

The role requires 1–3 years in a semiconductor manufacturing environment, familiarity with pick-and-place systems, dispensing mechanisms, and inspection equipment, plus a willingness to work rotating shifts.

Qualifications

• Associate degree or technical/vocational diploma in electronics, mechanical engineering, or related field.
• 1–3 years of experience in a die attach process in semiconductor manufacturing.
• Familiarity with pick-and-place systems, dispensing mechanisms, and microscopic inspection.

Responsibilities

• Load materials, configure recipes, and run die attach machines per work instructions. Create die attach recipe for new process bricks for LGA, BGA, QFN and flip chip package.
• Process Monitoring: resolve major process issues using relevant tools in coordination with the local team.
• Quality Management: ensure proactive quality compliance; identify root causes and implement corrective actions to achieve customer satisfaction.
• Troubleshooting: identify and resolve machine errors and implement corrective actions to reduce scrap.
• Statistical analysis: support DOE activities, setup runs, and data gathering for new process bricks.

Skills

Die attach process

Semiconductor manufacturing

MS Office

Inspection equipment knowledge

Education

Associate degree or technical/vocational diploma

Tools

ESEC 2100

ASM 8912

ASM838

Datacon

Stencil printing equipment

Job description

Job Description

OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

YOUR ROLE

Performs specific task to support the development and validation of new process bricks on die attach process by establishing robust process setting, materials and equipment capability to enable successful development and release of new products to mass production.

• Equipment Setup & Operation:Load materials, configure recipes, and run die attach machines (epoxy, or solder) per work instructions. Create die attach recipe for new process bricks for LGA, BGA, QFN and flip chip package.
• Process Monitoring:Executes specific task and activities in resolution of major process issue utilizing expertise in the Assy process with available tools, methodologies in coordination with the local team.
• Quality Management:Ensures proactive quality compliance of new products. In case of issues, analyzes and identify root cause of the problems, recommend corrective actions; evaluate effectiveness of corrective action taken in order to achieve customer satisfaction. Supports programs for continuous quality improvement of new products and processes. able to identify on visual inspection die attach criteria and rejects.
• Troubleshooting:Identify and resolve machine errors and implement corrective actions for defects encountered to reduce scrap.
• Statistical analysis:Support Die attach Engineer on DOE activities, set-up, DOE runs and Data gathering to complete the new process brick development.

YOUR SKILLS & EXPERIENCES

• Education: Associate degree or technical/vocational diploma in electronics, mechanical engineering, or a related field.
• Experience: Minimum 1–3 years of experience in a die attach process on semiconductor manufacturing. Knowledgeable in Microsoft office.
• Technical Skills: Familiarity with pick-and-place systems, dispensing mechanisms, and microscopic inspection. Knowledgeable in ESEC 2100, ASM 8912, ASM838, Datacon and Stencil printing equipment.
• Soft Skills: Strong problem-solving abilities and willingness to work in rotating shifts.

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

To discover more, visit st.com/careers.