Die Attach Process Engineer I – Innovate Packaging Tech

MTI Advanced Test Development Corp.; Philippines; On-site; PHP 480,000 - 760,000; Full time

Job summary

Microchip Technology Inc. is seeking an Engineer I-Process – Die Attach to develop, characterize, qualify, and industrialize die attach processes for advanced semiconductor packaging platforms.

You will lead technology innovation, NPI, and manufacturing readiness while collaborating across Product Development, R&D, Operations, and external suppliers. The role focuses on robust die attach processes that deliver high yield, reliability, and manufacturability, with a strong emphasis on

Qualifications

• Bachelor's Degree in Electronics Engineering or related field.
• Minimum 3 years of semiconductor manufacturing experience with Die Attach exposure.
• Experience with DOE, Minitab/JMP, SPC, FMEA, GR&R and Six Sigma tools.
• Experience in process characterization and troubleshooting.
• Strong analytical, problem-solving, and communication skills.
• Ability to work in a team and maintain safety in cleanroom.

Responsibilities

• Lead die attach process development for new technology platforms and products.
• Establish process architecture, process windows, and technology roadmaps for wafer thinning applications.
• Drive innovation initiatives to advanced package requirements.
• Evaluate and implement new die attach technologies, materials, consumables, and equipment solutions.
• Develop best practices and standards; define process architecture, flow and critical parameters.
• Lead process characterization activities to establish robust operating windows and margins.
• Evaluate emerging technologies, materials, and equipment to enhance capabilities.
• Drive improvements in metallization, process capability, throughput and cost.

Skills

Analytical skills

Problem solving

Communication

Teamwork

Leadership

Education

Bachelor's degree in Electronics Engineering

Tools

DOE

Minitab/JMP

SPC

FMEA

GR&R

Six Sigma

Job description

Microchip Technology Inc. is seeking an Engineer I-Process – Die Attach to develop, characterize, qualify, and industrialize die attach processes for advanced semiconductor packaging platforms.

You will lead technology innovation, NPI, and manufacturing readiness while collaborating across Product Development, R&D, Operations, and external suppliers. The role focuses on robust die attach processes that deliver high yield, reliability, and manufacturability, with a strong emphasis on