Die Attach Process Tech — Precision & New Process Trials

STMicro; Calamba; On-site; PHP 670,000 - 1,116,000; Full time

Job summary

STMicroelectronics is seeking a Die Attach Process Engineer to support development and validation of process bricks, ensuring robust equipment capability and smooth transition to mass production. The role involves setting up equipment, creating recipes, and monitoring quality across LGA, BGA, QFN, and flip-chip packages.

The candidate should have an Associate degree or technical/vocational diploma in electronics or related field, 1–3 years of experience, and familiarity with pick-and-place and

Qualifications

• Associate degree or technical/vocational diploma in electronics, mechanical engineering, or a related field.
• Minimum 1–3 years of experience in a die attach process on semiconductor manufacturing.
• Knowledgeable in Microsoft Office and familiarity with pick-and-place systems, dispensing mechanisms, and microscopic inspection.

Responsibilities

• Equipment setup and operation for die attach machines (epoxy, or solder) per work instructions.
• Create die attach recipe for new process bricks for LGA, BGA, QFN and flip chip package.
• Process monitoring and resolution of major process issues in coordination with the local team.
• Quality management: ensure proactive quality compliance, analyze root causes, implement corrective actions, and support continuous quality improvement.
• Troubleshooting: identify and resolve machine errors and reduce scrap.
• DOE activities: setup, DOE runs and data gathering for new process brick development.

Skills

Problem solving

Rotating shifts

Education

Associate degree or technical/vocational diploma in electronics, mechanical engineering, or a related field

Tools

Microsoft Office

Pick-and-place systems

Dispensing mechanisms

Microscopic inspection

ESEC 2100

ASM 8912

ASM838

Datacon

Stencil printing equipment

Job description

STMicroelectronics is seeking a Die Attach Process Engineer to support development and validation of process bricks, ensuring robust equipment capability and smooth transition to mass production. The role involves setting up equipment, creating recipes, and monitoring quality across LGA, BGA, QFN, and flip-chip packages.

The candidate should have an Associate degree or technical/vocational diploma in electronics or related field, 1–3 years of experience, and familiarity with pick-and-place and