Engineer I- Process

MTI Advanced Test Development Corp.; Philippines; On-site; PHP 480,000 - 760,000; Full time

Job summary

Microchip Technology Inc. is seeking an Engineer I-Process – Die Attach to develop, characterize, qualify, and industrialize die attach processes for advanced semiconductor packaging platforms.

You will lead technology innovation, NPI, and manufacturing readiness while collaborating across Product Development, R&D, Operations, and external suppliers. The role focuses on robust die attach processes that deliver high yield, reliability, and manufacturability, with a strong emphasis on

Qualifications

• Bachelor's Degree in Electronics Engineering or related field.
• Minimum 3 years of semiconductor manufacturing experience with Die Attach exposure.
• Experience with DOE, Minitab/JMP, SPC, FMEA, GR&R and Six Sigma tools.
• Experience in process characterization and troubleshooting.
• Strong analytical, problem-solving, and communication skills.
• Ability to work in a team and maintain safety in cleanroom.

Responsibilities

• Lead die attach process development for new technology platforms and products.
• Establish process architecture, process windows, and technology roadmaps for wafer thinning applications.
• Drive innovation initiatives to advanced package requirements.
• Evaluate and implement new die attach technologies, materials, consumables, and equipment solutions.
• Develop best practices and standards; define process architecture, flow and critical parameters.
• Lead process characterization activities to establish robust operating windows and margins.
• Evaluate emerging technologies, materials, and equipment to enhance capabilities.
• Drive improvements in metallization, process capability, throughput and cost.

Skills

Analytical skills

Problem solving

Communication

Teamwork

Leadership

Education

Bachelor's degree in Electronics Engineering

Tools

DOE

Minitab/JMP

SPC

FMEA

GR&R

Six Sigma

Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Job Description:

The Engineer I-Process – Die Attach is responsible for the development, characterization, qualification, and industrialization of die attach process supporting advanced semiconductor packaging platforms The role focuses on developing robust die attach processes that enable high-yield, reliable, and manufacturable products.

The position serves as the technical lead for Die Attach process development activities, driving technology innovation, new product introduction (NPI), process optimization, and manufacturing readiness while collaborating with Product Development, R&D, Equipment Engineering, Operations, Quality, and external suppliers.

Job Responsibilities:

• Lead the development and qualification of die attach processes for new technology platforms and products.
• Establish process architecture, process windows, and technology roadmaps for wafer thinning applications.
• Drive innovation initiatives to advanced package requirements.
• Evaluate and implement new die attach technologies, materials, consumables, and equipment solutions.
• Develop best practices and standards
• Define process architecture, process flow, and critical process parameters to meet design, reliability, and manufacturability requirements.
• Lead process characterization activities to establish robust operating windows and process margins.
• Evaluate emerging technologies, materials, and equipment to enhance technical capabilities and competitive advantage.
• Drive innovation initiatives to improve metallization performance, process capability, throughput, and cost effectiveness.
• Lead process transfer from development to pilot and high-volume manufacturing.
• Generate process specifications, control plans, operating procedures, and qualification reports.
• Ensure developed processes meet manufacturability, reliability, and cost targets.
• Support manufacturing teams during technology ramp and early production phases.
• Drive process stabilization and continuous improvement following production release.
• Serve as Subject Matter Expert (SME) for Die Attach and stencil print process.

Requirements/Qualifications:

• Bachelor's Degree in Electronics Engineering, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, Semiconductor Engineering, Physics, Related Engineering disciplines
• Minimum 3 years of semiconductor manufacturing experience with direct experience in Die Attach process
• Engineering tools: Design of Experiment (DOE), Minitab or JMP, Statistical Process Control (SPC), FMEA, GRR and Six Sigma tools
• Familiarity with process characterization, recipe creation, and equipment or process troubleshooting
• Strong analytical and problem-solving skills; ability to interpret SPC charts and process data.
• Good communication skills and ability to work in a team-oriented environment.
• Knowledge of safety protocols and cleanroom practices.
• Proficiency in MS Office and maintenance management systems.
• Strong analytical and problem-solving skills
• Leadership and mentoring capability
• Good communication and teamwork skills
• High attention to detail and sense of accountability

Travel Time:

No Travel