Principal Engineer Equipment Engineering

Randstad; Kuala Lumpur; On-site; MYR 180,000 - 320,000; Full time

Job summary

Randstad represents a Global Leader in Semiconductor Solutions in Malaysia. The Principal Engineer for Equipment Engineering will be the definitive technical authority for wire bond equipment and will lead a high-performing team to drive continuous improvement.

The role encompasses governance from concept to sustainment, KPI-driven optimization, integration of new machinery, and systematic maintenance to ensure peak performance within budget.

Qualifications

• Bachelor's or Master's degree in Mechanical, Electronics, Mechatronics or Automation Engineering.
• 8+ years of proven engineering experience in the Semiconductor industry, with deep expertise in Wire Bond.
• Lean manufacturing and quality tools, including 8D and DMAIC.
• Strong leadership and cross-functional collaboration skills.

Responsibilities

• Technical Leadership: lead and mentor a technical team in maintenance strategies.
• Equipment Governance: own end-to-end equipment governance from concept to sustainment.
• Wire Bond Optimization: define KPIs and drive improvements for wire bond equipment.
• New Machine Integration: standardize hardware/software for new machinery.
• Systematic Maintenance: ensure high equipment availability and reliability within budgets.
• Zero-Defect Drive: eliminate repetitive breakdowns through rigorous calibration.
• Advanced Integration: integrate machinery with APC tools and semi-automated systems.
• Cost Efficiency: meet Total Cost Reduction targets through improvements.
• Talent Development: build and certify a high-performing team.

Education

Bachelor's or Masters Degree

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

We are representing a Global Leader in Semiconductor Solutions and a driving force behind the decarbonization and digitalization of our world. As one of the top 10 semiconductor manufacturers globally and a European tech powerhouse, we create the microelectronics that link the real and the digital world. Join our state-of-the-art facility and leverage your expertise to shape the next generation of smart mobility, efficient power management, and the IoT.

Job Details

About the Company

We are representing a Global Leader in Semiconductor Solutions and a driving force behind the decarbonization and digitalization of our world. As one of the top 10 semiconductor manufacturers globally and a European tech powerhouse, we create the microelectronics that link the real and the digital world. Join our state-of-the-art facility and leverage your expertise to shape the next generation of smart mobility, efficient power management, and the IoT.

Your Role

As the Principal Engineer for Equipment Engineering, you will be the definitive technical authority and governance owner for our wire bond equipment. You will lead a high-performing team to drive continuous improvement, define proactive maintenance strategies, and ensure our machinery operates at peak performance.

Key Responsibilities

• Technical Leadership: Lead and mentor a technical team in defining and executing comprehensive planned maintenance strategies, ensuring robust and timely preventative care across all equipment.
• Equipment Governance: Act as the end-to-end Equipment Governance Owner—from conceptualization and piloting to full-scale implementation, monitoring, and long-term sustainment.
• Wire Bond Optimization: Spearhead the strategic direction for wire bond equipment by establishing effective KPIs, monitoring systems, and driving continuous equipment enhancements within your designated area.
• New Machine Integration: Leverage past maintenance data and continuous improvement activities to accelerate the optimal performance of new machinery. Develop and govern standardized hardware and software protocols.
• Systematic Maintenance: Design and deploy a systematic maintenance framework to guarantee high equipment availability, exceptional reliability, and safe operation—all while strictly adhering to targeted budgets.
• Zero-Defect Drive: Champion systematic equipment enhancements, rigorous calibration routines, and robust countermeasures to permanently eliminate repetitive breakdowns.
• Advanced Integration: Enhance equipment stability by integrating machinery with Advanced Process Control (APC) tools and semi-automated integration systems.
• Cost Efficiency: Drive and execute strategic equipment improvement initiatives to consistently meet or exceed Total Cost Reduction (TCR) targets.
• Talent Development: Develop, evaluate, and certify a high-performing team of Engineers and Technicians in strict alignment with our global organizational competency models.

Your Profile

• Education: A Bachelor's or Master's Degree in Mechanical, Electronics, Mechatronics, or Automation Engineering.
• Experience: A minimum of 8 years of proven engineering experience in the Semiconductor industry, with deep, specialized expertise in the Wire Bond process.
• Technical Acumen: Strong command of lean manufacturing and quality tools, specifically 8D and DMAIC problem-solving methodologies.
• Risk Management: Exceptional foresight with the proactive ability to detect and mitigate technical and operational risks early.
• Leadership: A proven track record of leading teams and driving strategic initiatives to deliver concrete, measurable results.
• Communication: An excellent communicator who builds strong relationships and thrives in collaborative, cross-functional project environments.

Skills

no additional skills required

Qualification

no additional qualifications required

Education

Bachelor Degree