Wire Bond Process Engineer: Yield & Quality Accelerator

ASE Electronics Malaysia; Bayan Lepas; On-site; MYR 60,000 - 90,000; Full time

Job description

Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.

Basic technical knowledge in Electronic/Semiconductors. Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.

Job Overview

Wire bond Engineer is responsible for designing, developing and optimizing process for manufacturing to achieve delivery goals and quality.

Requirements

• Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
• Basic technical knowledge in Electronic/Semiconductors. Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.

Responsibility

• Develop, formulate, evaluate and execute process engineering in area of responsibility to improve yield, quality and productivity and cost.
• Monitor, identifies, verifies analysis and give disposition to process related and technical concern of the product.
• Conduct evaluation to characterize failure in terms of extent of damage and gives disposition on implications attribute to process handling materials defects or machine trouble.
• Follow up all on going evaluation in the assigned area and handle on the line technical trouble.
• Interfaces with personnel on production, QA and other support groups regarding product/process related problems and disposition.
• Prepares the necessary process instruction and conduct training to the floor member.
• Review process requirements, customers specifications and standard.
• Drive cost reduction project or second source program.
• Liaise with customer on matters related to yield, quality, etc

Benefits

• Annual Leave
• Medical and Hospitalisation Leave
• EPF
• SOCSO
• Annual Bonus
• Medical Insurance