Senior Process Engineer

Unisem

Gopeng

On-site

MYR 89,000 - 134,000

Full time

3 days ago
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Benefits offered by this job

Attendance Incentive
Medical & Dental Benefits
Car Loan Interest Subsidy
Birthday Gift

Job summary

Unisem, a global semiconductor packaging and testing leader, seeks a Senior Process Engineer for our Simpang Pulai/Gopeng, Perak facility. You will drive process excellence, lead DOE/ SPC initiatives, and collaborate with cross-functional teams to support high-volume assembly and new package development.

You will mentor junior engineers, interface with customers, and pursue cost optimization to improve yield and product integrity in a fast-paced environment.

Qualifications

  • Bachelor's degree in Engineering, Applied Physics, Applied Chemistry, or related field.
  • Minimum 2 years of semiconductor experience in assembly or process engineering.
  • Fluent in English; Mandarin proficiency is an added advantage for customer liaison.
  • Strong communication and interpersonal skills.

Responsibilities

  • Production support: Lead semiconductor assembly engineering activities to meet high-volume production requirements.
  • Process optimization: Conduct evaluations, process mapping, and DOE to improve yield, quality, and cost efficiency.
  • Material assessment: Assess suspect materials and provide timely dispositions to ensure product integrity.
  • Problem-solving: Analyze day-to-day process issues, enhance detection methods, and implement preventive actions.
  • Customer interface: Collaborate with customers to support new package development and address technical feedback.
  • Value engineering: Identify and implement cost-effective improvements in package assembly processes.
  • Mentorship: Guide and support junior engineers in technical problem-solving and process improvement initiatives.

Skills

DOE
SPC
Process validation
Analytical skills
Communication
Interpersonal skills

Education

Bachelor's Degree in Engineering, Applied Physics, Applied Chemistry, or related field

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

Unisem is a leading global provider of semiconductor assembly and test services, offering end-to-end packaging, testing, and engineering solutions to the world's top electronics companies. Headquartered in Kuala Lumpur, Malaysia, Unisem operates manufacturing facilities in Ipoh, Malaysia, and Chengdu, China, with approximately 6,000 employees worldwide.

What We Offer
  • Attendance Incentive
  • Medical & Dental Benefits
  • Car Loan Interest Subsidy
  • Birthday Gift
About Us

Unisem is a leading global provider of semiconductor assembly and test services, offering end-to-end packaging, testing, and engineering solutions to the world's top electronics companies. Headquartered in Kuala Lumpur, Malaysia, Unisem operates manufacturing facilities in Ipoh, Malaysia, and Chengdu, China, with approximately 6,000 employees worldwide.

Job Summary

We are seeking a highly motivated Senior Process Engineer to join our semiconductor assembly team in Simpang Pulai/Gopeng, Perak. This role is critical in driving process excellence, yield improvement, and cost optimization in high-volume manufacturing. The successful candidate will lead engineering initiatives, collaborate with cross-functional teams, and interface with customers to support new package development and continuous improvement.

Key Responsibilities
  • Production support: Lead semiconductor assembly engineering activities to meet high-volume production requirements.
  • Process optimization: Conduct evaluations, process mapping, and design of experiments (DOE) to improve yield, quality, and cost efficiency.
  • Material assessment: Assess suspect materials and provide timely dispositions to ensure product integrity.
  • Problem-solving: Analyze day-to-day process issues, enhance detection methods, and implement preventive actions.
  • Customer interface: Collaborate with customers to support new package development and address technical feedback.
  • Value engineering: Identify and implement cost-effective improvements in package assembly processes.
  • Mentorship: Guide and support junior engineers in technical problem-solving and process improvement initiatives.
Job Requirements
  • Bachelor's Degree in Engineering, Applied Physics, Applied Chemistry, or related field.
  • Minimum 2 years of relevant experience in the semiconductor industry, preferably in assembly or process engineering.
  • Strong knowledge of DOE, SPC, and process validation methodologies.
  • Independent, self-motivated, with excellent analytical, communication, and interpersonal skills.
  • Fluent in English; Mandarin proficiency is an added advantage for customer liaison.
  • Based in Simpang Pulai or Gopeng, Perak.
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