Principal Engineer Equipment Engineering

Randstad Malaysia; Kuala Lumpur; On-site; MYR 300,000 - 520,000; Full time

Job summary

Global Leader in Semiconductor Solutions in Malaysia seeks a Principal Engineer for Equipment Engineering. You will be the technical authority on wire bond equipment, lead a high-performing team, and drive proactive maintenance strategies to maximize uptime and performance.

You will establish KPIs, govern hardware/software standards, and champion cost-efficient, safe operations while mentoring engineers and technicians across functions.

Qualifications

• Bachelor’s or Master’s degree in Mechanical, Electronics, Mechatronics, or Automation Engineering.
• Minimum of 8 years of engineering experience in the semiconductor industry, with wire bond expertise.
• Lean manufacturing and quality tools; experience with 8D and DMAIC methodologies.

Responsibilities

• Technical Leadership: lead and mentor a technical team in defining and executing planned maintenance strategies.
• Equipment Governance: act as end-to-end equipment governance owner from conceptualization to sustainment.
• Wire Bond Optimization: set KPIs, monitoring systems and drive improvements in wire bond equipment.
• New Machine Integration: leverage maintenance data to optimize new machinery and standardize protocols.
• Systematic Maintenance: design a maintenance framework for high availability, reliability and safety.
• Zero-Defect Drive: push for systematic improvements to eliminate breakdowns.
• Advanced Integration: enhance stability by integrating with APC tools and semi-automatic systems.
• Cost Efficiency: pursue equipment improvements to meet Total Cost Reduction targets.
• Talent Development: develop and certify engineers and technicians per competency models.

Skills

Leadership

Communication

Risk Management

Technical Acumen

Education

Bachelor’s or Master’s degree in Mechanical, Electronics, Mechatronics, or Automation Engineering

Tools

DMAIC

8D problem solving

Job description

About the Company

We are representing a Global Leader in Semiconductor Solutions and a driving force behind the decarbonization and digitalization of our world. As one of the top 10 semiconductor manufacturers globally and a European tech powerhouse, we create the microelectronics that link the real and the digital world. Join our state-of-the-art facility and leverage your expertise to shape the next generation of smart mobility, efficient power management, and the IoT.

Your Role

As the Principal Engineer for Equipment Engineering, you will be the definitive technical authority and governance owner for our wire bond equipment. You will lead a high-performing team to drive continuous improvement, define proactive maintenance strategies, and ensure our machinery operates at peak performance.

Key Responsibilities

• Technical Leadership: Lead and mentor a technical team in defining and executing comprehensive planned maintenance strategies, ensuring robust and timely preventative care across all equipment.

• Equipment Governance: Act as the end-to-end Equipment Governance Owner—from conceptualization and piloting to full-scale implementation, monitoring, and long-term sustainment.

• Wire Bond Optimization: Spearhead the strategic direction for wire bond equipment by establishing effective KPIs, monitoring systems, and driving continuous equipment enhancements within your designated area.

• New Machine Integration: Leverage past maintenance data and continuous improvement activities to accelerate the optimal performance of new machinery. Develop and govern standardized hardware and software protocols.

• Systematic Maintenance: Design and deploy a systematic maintenance framework to guarantee high equipment availability, exceptional reliability, and safe operation—all while strictly adhering to targeted budgets.

• Zero-Defect Drive: Champion systematic equipment enhancements, rigorous calibration routines, and robust countermeasures to permanently eliminate repetitive breakdowns.

• Advanced Integration: Enhance equipment stability by integrating machinery with Advanced Process Control (APC) tools and semi-automated integration systems.

• Cost Efficiency: Drive and execute strategic equipment improvement initiatives to consistently meet or exceed Total Cost Reduction (TCR) targets.

• Talent Development: Develop, evaluate, and certify a high-performing team of Engineers and Technicians in strict alignment with our global organizational competency models.

Your Profile

• Education: A Bachelor’s or Master’s Degree in Mechanical, Electronics, Mechatronics, or Automation Engineering.

• Experience: A minimum of 8 years of proven engineering experience in the Semiconductor industry, with deep, specialized expertise in the Wire Bond process.

• Technical Acumen: Strong command of lean manufacturing and quality tools, specifically 8D and DMAIC problem-solving methodologies.

• Risk Management: Exceptional foresight with the proactive ability to detect and mitigate technical and operational risks early.

• Leadership: A proven track record of leading teams and driving strategic initiatives to deliver concrete, measurable results.

• Communication: An excellent communicator who builds strong relationships and thrives in collaborative, cross-functional project environments.

skills

no additional skills required

qualifications

no additional qualifications required

education

Bachelor Degree