Wire Bond Process & Equipment Engineer (open to fresh graduate)

ASE Electronics (M) Sdn Bhd

Bayan Lepas

On-site

MYR 50,000 - 73,000

Full time

13 days ago
Application generator

Stand out for this role — generate a tailored resume and cover letter in about a minute.

Get past ATS filters

Job summary

ASE Electronics (M) Sdn Bhd in Penang is seeking a Wire Bond Process & Equipment Engineer, open to fresh graduates. The role focuses on designing, developing and optimizing wire bond processes to meet delivery goals and quality standards.

You will collaborate with production, QA and support groups to resolve process-related issues and train floor staff. The ideal candidate will hold a degree in Electronics/Electrical Engineering and have mechanical engineering knowledge, with basic semiconductor

Qualifications

  • Degree in Electronics/Electrical Engineering.
  • Mechanical engineering understanding is a plus.
  • Basic technical knowledge in Electronics/Semiconductors.

Responsibilities

  • Develop, formulate, evaluate and execute process engineering in area of responsibility to improve yield, quality and productivity and cost.
  • Monitor, identifies, verifies analysis and give disposition to process related and technical concern of the product.
  • Conduct evaluation to characterize failure in terms of extent of damage and gives disposition on implications attribute to process handling materials defects or machine trouble.
  • Follow up all on going evaluation in the assigned area and handle on the line technical trouble.
  • Interfaces with production, QA and other support groups regarding product/process related problems and disposition.
  • Prepares the necessary process instruction and conduct training to the floor member.
  • Review process requirements, customers specifications and standard.
  • Drive cost reduction project or second source program.
  • Liaise with customer on matters related to yield, quality, etc

Skills

Basic technical knowledge

Education

Electronics/Electrical Engineering
Mechanical Engineering

Job description

Wire Bond Process & Equipment Engineer (open to fresh graduate)

Wire bond Engineer is responsible for designing, developing and optimizing process for manufacturing to achieve delivery goals and quality.

Primary Responsibilities:

Develop, formulate, evaluate and execute process engineering in area of responsibility to improve yield, quality and productivity and cost.

Monitor, identifies, verifies analysis and give disposition to process related and technical concern of the product.

Conduct evaluation to characterize failure in terms of extent of damage and gives disposition on implications attribute to process handling materials defects or machine trouble.

Follow up all on going evaluation in the assigned area and handle on the line technical trouble.

Interfaces with personnel on production, QA and other support groups regarding product/process related problems and disposition.

Prepares the necessary process instruction and conduct training to the floor member.

Review process requirements, customers specifications and standard.

Drive cost reduction project or second source program.

Liaise with customer on matters related to yield, quality, etc

Qualification & Experience:

Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.

Basic technical knowledge in Electronic/Semiconductors.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Wire Bond Process Engineer – Yield & Quality Optimizer
Wire Bond Process Engineer – Yield & Quality Optimizer

ASE Electronics (M) Sdn Bhd • Bayan Lepas

On-site
MYR 50,000 - 73,000
SENIOR PROCESS MOL (WIRE BOND) ENGINEER
SENIOR PROCESS MOL (WIRE BOND) ENGINEER

Fairwork • Ipoh

On-site
Shift Technician ( Wirebond / AOI ) (open to fresh graduate)
Shift Technician ( Wirebond / AOI ) (open to fresh graduate)

ASE Electronics (M) Sdn Bhd • Bayan Lepas

On-site
MYR 29,000 - 42,000
Wire Bond Process Engineer: Yield & SPC Optimization
Wire Bond Process Engineer: Yield & SPC Optimization

Fairwork • Ipoh

On-site
Principal Engineer Equipment Engineering
Principal Engineer Equipment Engineering

Randstad Malaysia • Kuala Lumpur

On-site
MYR 300,000 - 520,000
Wire Bond Process & Equipment Senior/Staff Engineer
Wire Bond Process & Equipment Senior/Staff Engineer

Nexperia • Seremban

On-site
MYR 120,000 - 180,000
Senior Staff Engineer Unit Process Engineering
Senior Staff Engineer Unit Process Engineering

Infineon Technologies AG • Malacca City

On-site
MYR 180,000 - 300,000
Die Bond & Wire Bond Process Owner Engineer
Die Bond & Wire Bond Process Owner Engineer

Nexperia • Seremban

On-site
MYR 72,000 - 108,000
Senior Staff Engineer Maintenance Wire Bond
Senior Staff Engineer Maintenance Wire Bond

Infineon Technologies • Malacca City

On-site
MYR 60,000 - 90,000
Semiconductor Equipment Technician - Die & Wire Bonding
Semiconductor Equipment Technician - Die & Wire Bonding

Semiconductor Components Industries, LLC • Seremban

On-site