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ASE Electronics (M) Sdn Bhd in Penang is seeking a Wire Bond Process & Equipment Engineer, open to fresh graduates. The role focuses on designing, developing and optimizing wire bond processes to meet delivery goals and quality standards.
You will collaborate with production, QA and support groups to resolve process-related issues and train floor staff. The ideal candidate will hold a degree in Electronics/Electrical Engineering and have mechanical engineering knowledge, with basic semiconductor
Wire bond Engineer is responsible for designing, developing and optimizing process for manufacturing to achieve delivery goals and quality.
Primary Responsibilities:
Develop, formulate, evaluate and execute process engineering in area of responsibility to improve yield, quality and productivity and cost.
Monitor, identifies, verifies analysis and give disposition to process related and technical concern of the product.
Conduct evaluation to characterize failure in terms of extent of damage and gives disposition on implications attribute to process handling materials defects or machine trouble.
Follow up all on going evaluation in the assigned area and handle on the line technical trouble.
Interfaces with personnel on production, QA and other support groups regarding product/process related problems and disposition.
Prepares the necessary process instruction and conduct training to the floor member.
Review process requirements, customers specifications and standard.
Drive cost reduction project or second source program.
Liaise with customer on matters related to yield, quality, etc
Qualification & Experience:
Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.