Die Prep Equipment Engineer (MES Project) at Texas Instruments

Texas Instruments; Malaysia; On-site; MYR 70,000 - 110,000; Full time

Job summary

Texas Instruments in Malaysia is seeking a Die Prep Equipment Engineer for an MES project. This on-site, full-time role drives MES rollout for Die Prep/Dicing equipment, defines workflows, and ensures integration readiness.

The candidate should hold a Bachelor's degree in an engineering field and have at least two years of hands-on semiconductor equipment experience. Collaboration across functions is key for reliability and automation improvements.

Qualifications

• Bachelor's degree in an engineering field or related discipline.
• Minimum 2 years of hands-on semiconductor equipment experience in Die Prep/Dicing.
• Experience with MES platforms and integration is preferred.

Responsibilities

• Represent Die Prep equipment engineering during MES rollout and define workflows.
• Translate hardware requirements into digital designs and data collection points.
• Validate integration scenarios and support UAT and deployment.
• Transition to production and leverage MES data for predictive maintenance.

Skills

Die Prep/Dicing equipment

Cross-functional collaboration

Data interpretation

Education

Bachelor's degree in Electrical Engineering

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Chemical Engineering

Tools

Siemens OpCenter MES

MES configuration

Job description

Die Prep Equipment Engineer (MES Project)

This Full time on site position offers great opportunities for career growth. Change the world. Love your job.

Key Responsibilities

• MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.
• Integration & Data: Translate Die Prep hardware requirements (e.g., dicing/sawing mechanics) into digital designs. Define data collection points for equipment health and interlock logic.
• Validation: Validate integration scenarios and support UAT and deployment.
• Sustaining (Post-Project Phase): Transition to production to maintain Die Prep equipment reliability and leverage MES data for predictive maintenance and automation.

Qualifications

• Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
• Strong hands-on semiconductor equipment experience in Die Prep/Dicing equipment, with minimum 2 years of relevant experience

Preferred Qualifications

• Equipment experience with Backgrind, Mechanical Saw, Laser Saw are welcome
• Experience working with MES platforms, whether Siemens OpCenter or another comparable MES product modeling or configuration
• Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalte early
• Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
• Working knowledge of semiconductor manufacturing, and SPC techniques.
• Experienced with semiconductor cleanroom protocol and behaviors.
• Strong verbal and written communication skills
• Demonstrated strong analytical, critical thinking and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationship

About Us

Why TI?

Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.

We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.

Meet the people of TI

• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life.
• Your well-being is important to us.
• Please find our country-specific benefits here

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment.

At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

Equal Opportunity Statement

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

Job Information

Job Identification 25018262

Job Category Manufacturing

Posting Date 09/28/2026, 06:53 AM

Apply Before 10/15/2026, 11:00 AM

Degree Level Bachelor's Degree

Locations KUAL 1, Lorong Enggang 33, Ampang, Kuala Lumpur, 54200, MY

ECL/GTC Required Yes