Principal Technology Development Engineer – Epoxy Underfill (CUF) Process

FusionAP Sdn Bhd; Penang; On-site; MYR 200,000 - 320,000; Full time

Job summary

FusionAP Sdn Bhd is seeking a Principal Technology Development Engineer for Epoxy Underfill (CUF) processes in Penang. You will own CUF dispensing, characterizing and optimizing recipes for fine-pitch FCBGA and multi-die architectures.

The role requires 10+ years in semiconductor process engineering, program capability for precision dispensing equipment, and a strong background in fluid dynamics and polymer physics.

Qualifications

• Bachelor’s degree in chemical engineering, materials science, mechanical engineering, applied physics, or related field.
• 10+ years of hands‑on semiconductor process engineering experience in advanced packaging.
• Experience operating and programming automated dispensing equipment.
• Strong knowledge of SPC and DOE for process optimization.
• Experience with metrology tools such as C‑SAM, X‑ray, and cross‑sectional microscopy.

Responsibilities

• Develop CUF dispensing recipes for high-density, fine-pitch FCBGA and multi-die chiplet architectures.
• Program and calibrate precision dispensing equipment (jetting valves, auger pumps, volumetric pumps).
• Apply fluid dynamics and polymer physics to control capillary flow of epoxy in constrained geometries.
• Lead DOE studies, RCFA, and SPC to drive yield improvements and quality control.
• Prepare PFMEAs, SOPs, and Control Plans for high-volume manufacturing transfer.

Skills

Dispensing equipment programming

Statistical analysis (SPC/DOE)

Design of Experiments

Process optimization

Root cause analysis (RCFA)

Cross-functional communication

Education

Bachelor's degree in chemical engineering, materials science, mechanical engineering, applied physics, or related field

Tools

Jetting valves

Auger pumps

Volumetric pumps

C-SAM

X-ray

Cross-section microscopy

Job description

Principal Technology Development Engineer – Epoxy Underfill (CUF) Process

About FusionAP FusionAP is a Malaysia-based startup advanced packaging company focused on delivering innovative 2.5D, 3D, and next-generation packaging solutions. Through engineering excellence and strategic partnerships, FusionAP enables cutting-edge technologies for AI, high-performance computing (HPC) to co-packaged optic , and other advanced semiconductor applications. We are building a world-class engineering team to develop and industrialize advanced packaging technologies that power the future of computing and are looking for like minded vibrant individuals to be part of the journey.

Principal Technology Development Engineer – Epoxy Underfill (CUF) Process

Senior Level | 10+ Years Experience | FCBGA Assembly, Die-to-Wafer 2.5D Packaging

Role Summary: The rapid expansion of high-performance computing, artificial intelligence, and automotive electronics requires advanced Flip Chip Ball Grid Array (FCBGA) packaging with uncompromising reliability 1. We are seeking an innovative and highly capable Principal Technology Development Engineer specializing in Capillary Underfill (CUF) processes.

In this critical Technology Development (TD) role, you will be the technical owner of liquid epoxy underfill dispensing, which is essential for encapsulating fine-pitch interconnects and protecting them from thermal fatigue. By applying fluid dynamics, polymer physics, and rigorous experimentation, you will develop precision CUF processes that support the mass production of next-generation, high-reliability semiconductor packages.

Key Responsibilities

• Process Development & Dispensing Optimization: Develop, characterize, and establish baseline manufacturing recipes for CUF dispensing in high-density, fine-pitch FCBGA and multi-die chiplet architectures. You will program and calibrate precision dispensing equipment, including high-speed jetting valves and volumetric Progressive Cavity Displacement (PCD) pumps.
• Fluid Dynamics & Polymer Physics: Apply analytical models to understand and control the capillary flow of silica-filled epoxies between parallel plates. You will conduct fluid dynamics modelling to control flow rates, eliminate voiding, and optimize fillet cosmetics.
• Experimental Rigor: Design and execute multi-factor Design of Experiments (DOE) to establish robust process windows and performance baselines. Effectively utilize Scanning Acoustic Microscopy (C-SAM) to inspect for underfill voids and delamination and conduct root cause failure analysis (RCFA) using cross-sectioning and SEM to drive corrective action plans.
• Yield Improvement & Quality Control: Lead continuous yield improvement, defect reduction, and cost optimization initiatives. Implement Statistical Process Control (SPC) and apply methodologies like FMEA, Control Plans for effective early signal detection. You will optimize the process for various bump standoff heights to prevent underfill voids, particularly in large die applications, and ensure the process meets stringent reliability standards by completely avoiding filler entrapment issues associated.
• Technology Transfer & Quality Control: Own the transition of CUF processes from R&D pathfinding to high-volume manufacturing (HVM). You will author Process Failure Mode and Effects Analyses (pFMEAs), standard operating procedures (SOPs), and Control Plans while ensuring all materials comply with RoHS workmanship standards.

Minimum Qualifications

• Bachelor’s degree in chemical engineering, Materials Science, Mechanical Engineering, Applied Physics, or a related technical discipline.
• 10+ years of hands‑on experience in semiconductor process engineering, specifically focused on advanced packaging, flip‑chip assembly, or precision fluid dispensing.
• Direct experience operating and programming automated dispensing equipment (e.g., jetting valves, auger pumps, or volumetric pumps).
• Strong understanding of statistical analysis platforms and hands‑on experience utilizing SPC and DOE for process optimization.
• Demonstrated ability to perform defect analysis using metrology tools such as C‑SAM, X‑ray, and cross‑sectional microscopy.
• Excellent communication skills with the ability to present data‑driven recommendations to cross‑functional teams.

Preferred Qualifications

• Master’s degree or Ph.D. in Polymer Chemistry, Chemical Engineering, or Materials Science 11.
• Deep fundamental knowledge of epoxy resin chemistry, filler behaviour, and the physics of capillary flow in constrained geometries.
• Prior experience qualifying packages for automotive applications and familiarity with IATF 16949 and AEC‑Q100 reliability standards.
• Experience writing automation scripts or using Python/SQL for analysing large sets of critical‑to‑quality manufacturing data.

Additional Information

• Travel: minimum, except for training at suppliers or technical conferences.
• Language: Fluent English (written and verbal); additional language proficiency a plus for global collaboration.