Principal Epoxy Underfill Process Engineer (CUF)

FusionAP Sdn Bhd; Penang; On-site; MYR 200,000 - 320,000; Full time

Job summary

FusionAP Sdn Bhd is seeking a Principal Technology Development Engineer for Epoxy Underfill (CUF) processes in Penang. You will own CUF dispensing, characterizing and optimizing recipes for fine-pitch FCBGA and multi-die architectures.

The role requires 10+ years in semiconductor process engineering, program capability for precision dispensing equipment, and a strong background in fluid dynamics and polymer physics.

Qualifications

• Bachelor’s degree in chemical engineering, materials science, mechanical engineering, applied physics, or related field.
• 10+ years of hands‑on semiconductor process engineering experience in advanced packaging.
• Experience operating and programming automated dispensing equipment.
• Strong knowledge of SPC and DOE for process optimization.
• Experience with metrology tools such as C‑SAM, X‑ray, and cross‑sectional microscopy.

Responsibilities

• Develop CUF dispensing recipes for high-density, fine-pitch FCBGA and multi-die chiplet architectures.
• Program and calibrate precision dispensing equipment (jetting valves, auger pumps, volumetric pumps).
• Apply fluid dynamics and polymer physics to control capillary flow of epoxy in constrained geometries.
• Lead DOE studies, RCFA, and SPC to drive yield improvements and quality control.
• Prepare PFMEAs, SOPs, and Control Plans for high-volume manufacturing transfer.

Skills

Dispensing equipment programming

Statistical analysis (SPC/DOE)

Design of Experiments

Process optimization

Root cause analysis (RCFA)

Cross-functional communication

Education

Bachelor's degree in chemical engineering, materials science, mechanical engineering, applied physics, or related field

Tools

Jetting valves

Auger pumps

Volumetric pumps

C-SAM

X-ray

Cross-section microscopy

Job description

FusionAP Sdn Bhd is seeking a Principal Technology Development Engineer for Epoxy Underfill (CUF) processes in Penang. You will own CUF dispensing, characterizing and optimizing recipes for fine-pitch FCBGA and multi-die architectures.

The role requires 10+ years in semiconductor process engineering, program capability for precision dispensing equipment, and a strong background in fluid dynamics and polymer physics.