Packaging Engineer: Die Attach & Advanced Packaging

Sandisk; Simpang Ampat; On-site; MYR 75,000 - 135,000; Full time

Job summary

Sandisk is seeking a Process/Pack engineering professional in Penang to drive die attach development, qualification, and transfer to high-volume manufacturing. You will lead technology development, DOE planning, and collaboration with global teams to advance memory packaging architectures.

The role emphasizes strong fundamentals in materials and process control, experience with packaging technology, and a proactive approach to problem-solving in a factory setting.

Qualifications

• Bachelor’s or Master’s Degree in Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline.
• Min 3 years relevant working experience in engineering.

Responsibilities

• Die Attach Process Module Engineering for Process/Materials Development, Qualification and Transfer to HVM.
• Lead technology development and tech-staging for packaging solutions.
• Collaborate with global cross-functional teams across process, materials, design, and quality.

Skills

Statistical analysis

Packaging development

Analytic skills

Communication & teamwork

Self-motivation & organization

Multitasking

Education

Bachelor’s or Master’s degree in engineering

Tools

SAP

MES

Power BI

Tableau

Six Sigma Green Belt

Job description

Sandisk is seeking a Process/Pack engineering professional in Penang to drive die attach development, qualification, and transfer to high-volume manufacturing. You will lead technology development, DOE planning, and collaboration with global teams to advance memory packaging architectures.

The role emphasizes strong fundamentals in materials and process control, experience with packaging technology, and a proactive approach to problem-solving in a factory setting.