Process Engineer

Sandisk; Penang; On-site; MYR 120,000 - 180,000; Full time

Job summary

Sandisk in Penang, Malaysia seeks a Senior Underfill Process Engineer to lead the UF process for flip-chip die-level assembly and drive yield improvements in high-volume production. You will develop new Underfill processes, run DOE studies, establish recipes, and mentor technicians while collaborating with Quality, Manufacturing and Product Engineering teams.

Strong background in semiconductor assembly, FMEA/SPC/DOE, and hands-on problem solving is essential to sustain process capability and

Qualifications

• Bachelor's Degree or higher in Engineering (Electrical, Mechanical, Physics, Materials Science, or related).
• Minimum 4-5 years of experience in semiconductor assembly process engineering.
• Experience in Underfill process development and sustaining.
• Strong knowledge of semiconductor assembly processes and flip-chip die-level assembly technology.
• Hands-on approach with a focus on production support, yield improvement, and quality excellence.

Responsibilities

• Own the Underfill (UF) process for flip-chip die-level assembly and drive process efficiency.
• Support assembly process engineering with solutions meeting quality and KPI targets.
• Lead process qualifications to achieve CTQ, CPK, and cost objectives.
• Provide technical training and mentoring on UF best practices to technicians and engineers.

Skills

Flip-chip UF process

Cross-functional collaboration

Yield improvement

Problem solving

Education

Bachelor's Degree in Engineering

Tools

Nordson dispenser

Heller reflow oven

C-Scan equipment

Job description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

ESSENTIAL DUTIES AND RESPONSIBILITIES

• Responsible for the Underfill (UF) process for flip-chip die-level assembly.
• Support Assembly Process Engineering in delivering process and equipment solutions that meet quality, development, and operational requirements.
• Maintain assembly yield and assembly test yield related to the Underfill process in line with department targets and KPIs, including lot bracketing and disposition.
• Set up new Underfill processes, materials, and recipes, including process window studies, DOE execution, and corner limit evaluations.
• Establish golden recipes for new package qualifications.
• Maintain Underfill recipe templates according to Positrol log guidelines.
• Lead process qualifications to achieve CTQ requirements, CPK targets, risk assessment requirements, UPH, yield, and cost objectives.
• Lead new product qualifications and ensure effective process handover and technology transfer.
• Support the qualification of new materials, equipment, and tools.
• Perform root cause analysis and problem-solving using methodologies such as 5M+1E, 5 Whys, DMAIC, and 8D.
• Monitor and optimize Underfill equipment performance, including preventive maintenance coordination and troubleshooting of process deviations.
• Develop and maintain comprehensive process documentation, including work instructions, process specifications, and technical reports for regulatory compliance and knowledge retention.
• Collaborate with cross-functional teams including Quality, Manufacturing, and Product Engineering to resolve process issues and implement continuous improvements.
• Provide technical training and mentoring to assembly technicians and junior engineers on Underfill process best practices and equipment operation.
• Carry out additional tasks and responsibilities assigned by the direct and indirect managers.

Qualifications

REQUIRED:

• Bachelor's Degree or higher in Engineering (Electrical, Mechanical, Physics, Materials Science, or a related field).
• Minimum 4-5 years of experience in semiconductor assembly process engineering.
• Experience in Underfill process development and sustaining.
• Strong knowledge of semiconductor assembly processes and flip-chip die-level assembly technology.
• Hands‑on approach with a strong focus on production support, yield improvement, and quality excellence.
• Working knowledge of Failure Mode and Effects Analysis (FMEA), Statistical Process Control (SPC), 8D Problem Solving, Six Sigma methodologies, Design of Experiments (DOE), and statistical analysis tools such as Minitab and JMP

Preferred

• Familiarity with Nordson dispenser, Heller reflow oven, and C-Scan equipment is an added advantage.
• Knowledge of underfill defect mechanisms such as voiding, fillet irregularities, incomplete fill, delamination, overflow, and package warpage.
• Experience supporting New Product Introduction (NPI), high volume manufacturing (HVM), process transfer, and manufacturing ramp-up activities.
• Familiarity with reliability qualification requirements, including MSL, TCT, HTS, HAST, and board-level reliability testing.
• Demonstrated success in improving underfill yield, cycle time, and process capability while supporting high-volume production and new product ramps.
• Familiarity with SEM, SAM (C-Scan), X-ray, and cross‑section analysis for failure investigation and process validation

Skills

• Strong project planning, execution, and problem-solving skills.
• High sense of quality, urgency, ownership, and accountability.
• Excellent communication, interpersonal, and teamwork skills.
• Proven experience in developing and maintaining process documentation, including work instructions, process specifications, control plans, OCAPs, and technical reports.
• Proficiency in structured problem-solving methodologies such as 5M+1E, 5 Whys, DMAIC, and 8D.
• Experience in equipment troubleshooting, preventive maintenance coordination, and process deviation management.
• Strong analytical skills with the ability to interpret process data and drive data‑driven decisions.
• Proven ability to lead cross‑functional collaboration with Manufacturing, Quality, Packaging Engineering, Equipment Engineering, and suppliers.
• Capability to provide technical coaching, training, and mentoring to operators, technicians, and junior engineers on process best practices and equipment operation.
• Self‑motivated, proactive, and capable of working independently in a fast‑paced manufacturing environment.
• Strong continuous improvement mindset with a focus on yield enhancement, cost reduction, cycle time improvement, and operational excellence.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [e-mail] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.