Packaging Engineer - Die Attach & Process Innovation

SanDisk; Batu Kawan; On-site; MYR 90,000 - 150,000; Full time

Job summary

Sandisk in Penang, Malaysia is seeking a Die Attach Process Module Engineer to drive development and transfer to high-volume manufacturing. You will lead technology development for memory packaging, collaborating with global teams across process, materials, package design, and quality to meet roadmap goals.

The role requires a Bachelor's or Master's in engineering and at least 3 years of relevant experience, with expertise in process control, DOE, SPC, and root-cause analysis.

Qualifications

• Bachelor's or Master's Degree in mechanical, electrical, electronics, microelectronics, mechatronics, or materials science.
• Minimum 3 years of relevant engineering experience.
• Experience in process recipe baseline (RBL) development.
• Strong knowledge of SPC, FMEA, DOE, and statistical analysis.

Responsibilities

• Lead Die Attach Process Module Engineering for development and transfer to high-volume manufacturing.
• Drive technology development to enable product, process and materials roadmap solutions for next-gen memory packaging.
• Liaise with global cross-functional teams across process, materials, package design, thermal-mechanical simulations, quality and other stakeholders.
• Build and nurture a strong process development team focused on high-density die attach processes and packaging architecture.
• Lead studies for fundamental investigations/characterization in packaging development.
• Ensure materials-to-process/design compatibility to meet quality and reliability requirements.
• Collaborate with equipment & material suppliers, service providers, academia and industry consortia on projects.
• Support digital transformation for packaging processes (Digital Twins, APC, FDC).
• Drive yield analysis in process characterization and qualification.

Skills

Statistical analysis

Packaging tech dev

Root cause analysis

Cross-functional teamwork

Problem solving

Communication skills

Self-motivated

Education

Engineering degree (Bachelor/Master)

Tools

SAP

MES

Power BI

Tableau

Six Sigma

Job description

Sandisk in Penang, Malaysia is seeking a Die Attach Process Module Engineer to drive development and transfer to high-volume manufacturing. You will lead technology development for memory packaging, collaborating with global teams across process, materials, package design, and quality to meet roadmap goals.

The role requires a Bachelor's or Master's in engineering and at least 3 years of relevant experience, with expertise in process control, DOE, SPC, and root-cause analysis.