Senior Process Engineer - Pre Assembly, Semicon, Penang
The senior engineer is tasked to support and improve critical pre-assembly manufacturing processes, focusing on process control, yield enhancement, defect reduction, and process optimization.
Our client is a leading multinational semiconductor manufacturing organization operating within the advanced packaging and semiconductor assembly ecosystem.
Description
- Owning process performance, yield, quality, and capability for assigned pre-assembly manufacturing processes.
- Leading root cause investigations and implementing corrective actions for manufacturing issues, customer complaints, and yield excursions.
- Driving defect reduction initiatives focused on wafer breakage, die chipping, cracking, and singulation-related failures.
- Managing process qualifications, material evaluations, and process optimization activities.
- Applying statistical tools such as SPC, DOE, CpK, and Minitab to improve process capability and robustness.
- Leading productivity, cost reduction, automation, and continuous improvement projects.
- Supporting customer escalations, MRB activities, and manufacturing disposition decisions.
- Collaborating closely with Production, Equipment Engineering, Product Engineering, Quality, and Global Technology teams.
Profile
- Bachelor's Degree in Engineering, Semiconductor Manufacturing, Materials Science, Physics, or a related discipline.
- Experience from OSAT, advanced packaging, backend semiconductor manufacturing.
- Minimum 2 years of semiconductor manufacturing experience
- Hands-on experience in at least two of the following:
- Wafer Saw / Dicing
- Wafer Coating
- Wafer Inspection
- Wafer Sputtering
- Proven experience driving:
- Yield improvement
- Productivity improvement
- Cost reduction projects
- NPI and qualification programs
- Strong root cause analysis and troubleshooting capabilities.
- Familiarity with SPC, DOE, FMEA, CpK, Minitab, and statistical analysis techniques.
- Strong communication and project management skills.
- Experience from OSAT, advanced packaging, backend semiconductor manufacturing
Job Offer
- Competitive salary package up to RM10,000 per month
- Exposure to acquisition integration, process transfer, and transformation projects.
- Opportunity to work in a growing semiconductor operation with expanding customer demand.
- Dual career progression pathways toward either technical specialist (IC) or people leadership roles.
- High visibility role with direct ownership of manufacturing yield and process improvements.