Staff Packaging Engineer - NPI & Subcontractor Assembly

Power Integrations

Bayan Lepas

On-site

MYR 120,000 - 180,000

Full time

14 days+

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Job summary

Power Integrations is seeking a Staff Packaging Engineer based in Penang, Malaysia to lead assembly and NPI improvements at a subcontractor factory. The role focuses on driving yield, quality, delivery, and cost in mass production and to manage new product introductions.

Candidate should have 8+ years in semiconductor assembly/NPI, with hands-on experience in wire bonding or molding, and strong project management skills. English fluency is required.

Qualifications

  • Bachelor’s degree or above in engineering.
  • Min 8 years of experience in semiconductor assembly process / NPI engineering or assembly subcon management.
  • Hand-on experience in wire bonding and/or molding process is very desirable.
  • Possess a good understanding on assembly process control and requirement.
  • Strong project management and problem-solving skills.
  • Fluent in English.
  • Technically competent, self-motivated, strong commitment and assertive

Responsibilities

  • To drive improvement on assembly yield, quality, delivery and cost on mass production products.
  • To manage new product introduction at subcontractor factory.
  • To support new products, process and package development.
  • To drive investigation and solution on customer complaint case.
  • To perform regular process and quality audit at subcontractor site.
  • Strong interaction with cross functional team on assembly engineering project.

Skills

Project management
Problem-solving
English fluency
Self-motivation
Assertive
Commitment

Education

Bachelor’s degree or above in engineering

Job description

Power Integrations is seeking a Staff Packaging Engineer based in Penang, Malaysia to lead assembly and NPI improvements at a subcontractor factory. The role focuses on driving yield, quality, delivery, and cost in mass production and to manage new product introductions.

Candidate should have 8+ years in semiconductor assembly/NPI, with hands-on experience in wire bonding or molding, and strong project management skills. English fluency is required.

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